High-strength electronic copper foil preparation method

An electronic copper foil, high-strength technology, applied in the direction of electroforming, electrolysis, etc., can solve the problem of low tensile strength of electrolytic copper foil, achieve excellent mechanical properties, meet the needs of development, and high elongation

Pending Publication Date: 2021-04-20
JIUJIANG TELFORD ELECTRONICS MATERIAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the problems in related technologies, the present invention proposes a preparation method of high-strength electronic copper foil, which solves the problem of low tensile strength of existing electrolytic copper foil

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] A method for preparing high-strength electronic copper foil according to an embodiment of the present invention includes the following steps:

[0014] Step S1, dissolving copper rods and copper wires into an aqueous solution with sulfuric acid as the main electrolyte, the contents of copper and sulfuric acid in the main electrolyte are 80g / L and 100g / L respectively;

[0015] Step S2, put additives into the main electrolyte, the additives include A agent, B agent, C agent,

[0016] The A agent is thiazolethione at 5 mg / l, the B agent is 8 mg / l 3-mercapto-1-propanesulfonate sodium, and the C agent is 10 mg / l polyethylene glycol;

[0017] Step S3, at a temperature of 55°C and a flow rate of 50 3 / h, the current density is 3000A / m 2 Under certain conditions, the main electrolyte with additives is electrolyzed;

[0018] Step S4: The main electrolyte is electrolyzed to electrodeposit a thickness of 9um on the cathode to obtain high-strength electronic copper foil.

Embodiment 2

[0020] A method for preparing high-strength electronic copper foil according to an embodiment of the present invention includes the following steps:

[0021] Step S1, dissolving copper rods and copper wires into an aqueous solution with sulfuric acid as the main electrolyte, the contents of copper and sulfuric acid in the main electrolyte are 95g / L and 120g / L respectively;

[0022] Step S2, put additives into the main electrolyte, the additives include A agent, B agent, C agent,

[0023] The A agent is thiazolethione at 5 mg / l, the B agent is 8 mg / l 3-mercapto-1-propanesulfonate sodium, and the C agent is 10 mg / l polyethylene glycol;

[0024] Step S3, at a temperature of 55°C and a flow rate of 50 3 / h, the current density is 3000A / m 2 Under certain conditions, the main electrolyte with additives is electrolyzed;

[0025] Step S4: The main electrolyte is electrolyzed to electrodeposit a thickness of 12um on the cathode to obtain high-strength electronic copper foil.

Embodiment 3

[0027] A method for preparing high-strength electronic copper foil according to an embodiment of the present invention includes the following steps:

[0028] Step S1, dissolving the copper rod, copper wire, and chloride into an aqueous solution with sulfuric acid as the main electrolyte, the contents of copper, sulfuric acid, and chlorine in the main electrolyte are respectively 80g / L, 100g / L, and 25mg / L;

[0029] Step S2, put additives into the main electrolyte, the additives include A agent, B agent, C agent,

[0030] The A agent is 18 mg / l fatty amine ethoxy sulfonate, the B agent is 20 mg / l sodium polydithiodipropane sulfonate and 2-mercaptobenzimidazole, and the C agent is 10 mg / l Sodium dodecylbenzenesulfonate;

[0031] Step S3, when the temperature is 55°C and the flow rate is 45 3 / h, the current density is 5600A / m 2 Under certain conditions, the main electrolyte with additives is electrolyzed;

[0032] Step S4: The main electrolyte is electrolyzed to electrodeposi...

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Abstract

The invention discloses a high-strength electronic copper foil preparation method. The method comprises the following steps that S1, a copper rod, a copper wire and chlorides are dissolved into an aqueous solution by using sulfuric acid to be adopted as a main electrolyte, contents of copper and the sulfuric acid in the main electrolyte being 60 g / L to 100 g / L, 70 g / L to 160 g / L and 0 mg / L to 25 mg / L respectively, S2, additives are put into the main electrolyte, the additives including an agent A, an agent B and an agent C with concentrations of 3 mg / L to 50 mg / L, 5 mg / L to 80 mg / L and 1 mg / L to 20 mg / L respectively; S3, the main electrolyte with the additives is electrolyzed under the conditions that a temperature is 35 DEG C to 65 DEG C, a flow is 45 m-50<3> / h and a current density is 2000 A / m<2> to 8200 A / m<2>; and S4, the main electrolyte is electrolyzed to form electro-deposition with a thickness of 9 microns to 105 microns on a cathode. According to the high-strength electronic copper foil preparation method, an electronic copper foil produced through the preparation method has the advantages of high tensile strength, high elongation and uniform thickness, and can meet the development requirement of an ultrahigh-density printed circuit board.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil, in particular to a method for preparing high-strength electronic copper foil. Background technique [0002] With the deepening of research and development and the continuous upgrading of technology, printed circuit boards are gradually developing in the direction of high density, small aperture, large capacity, and thinner, making the conductive lines made of electrolytic copper foil thinner and thinner, and the operating temperature is getting higher and higher. High, the process is becoming more and more complex, and the tension on the copper foil is also increasing. The tensile strength of traditional electrolytic copper foil is generally below 450MPa, which is difficult to meet the needs of the development of ultra-high-density printed circuit boards. Contents of the invention [0003] Aiming at the problems in the related art, the present invention proposes a method for p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/04
Inventor 金荣涛杨红光王小东
Owner JIUJIANG TELFORD ELECTRONICS MATERIAL CO LTD
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