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Inorganic lightweight aggregate insulation board with multilayer structure and preparation method thereof

A technology of inorganic light aggregate and multi-layer structure, which is applied in the direction of layered products, manufacturing tools, ceramic molding machines, etc., can solve the problems affecting the promotion and popularization of insulation boards, insufficient surface affinity of insulation boards, and insufficient bonding strength, etc. problem, to achieve the effect of improving compression resistance, good heat preservation effect, and compact appearance

Pending Publication Date: 2021-04-23
宁波荣山材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, after the steam curing and drying are completed, there will be some particles on the surface of the finished insulation board, and a few particles will fall off when rubbing with fingers, which seriously affects the appearance
[0004] Furthermore, the affinity between the surface of the thermal insulation board and the ordinary bonding mortar is not enough, and the bonding strength is insufficient, so special bonding mortar needs to be configured, which will undoubtedly affect the promotion and popularization of the thermal insulation board in the market

Method used

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  • Inorganic lightweight aggregate insulation board with multilayer structure and preparation method thereof
  • Inorganic lightweight aggregate insulation board with multilayer structure and preparation method thereof
  • Inorganic lightweight aggregate insulation board with multilayer structure and preparation method thereof

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Embodiment Construction

[0026] The technical solutions of the various embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments described in the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative work are within the protection scope of the present invention.

[0027] Embodiments of the present invention provide a multi-layer inorganic lightweight aggregate insulation board and a preparation method thereof. The multi-layer inorganic light aggregate insulation board, also known as the surface-enhanced inorganic light aggregate insulation board, is to add a very thin layer of high-density light aggregate layer to the surface of the original insulation board to make the surface of the insulation board smooth. , The affinity with the bonding ...

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Abstract

The invention discloses an inorganic lightweight aggregate insulation board with a multilayer structure. The insulation board comprises a surface enhancement layer, a thermal insulation layer and a bottom surface enhancement layer, wherein the thermal insulation layer is prepared from the following components in parts by weight: 360-450 parts of 20-30-mesh expanded perlite, 120-160 parts of cement and 20-60 parts of a modifier; the surface enhancement layer and the bottom surface enhancement layer comprise the following components in parts by weight: 50-100 parts of 50-70-mesh expanded perlite or slag, 100 parts of cement and 10 parts of a modifier; and the modifier comprises a cement reinforcing agent and an emulsion. According to the inorganic lightweight aggregate insulation board with the multilayer structure and the preparation method thereof, the produced insulation board is compact and smooth in appearance, the compression strength, the breaking strength and the water resistance can be improved, and the affinity with cement mortar is enhanced; the structure and thermal insulation are integrated, the internal dry density is low, the thermal insulation effect is good, the upper and lower surface strength is high, and a protective layer is made; and multiple times of material distribution and one-time forming are achieved, the integrity of the multilayer structure insulation board is guaranteed, and interface stripping is prevented.

Description

technical field [0001] The invention relates to a multi-layer inorganic light aggregate insulation board and a preparation method thereof. Background technique [0002] At present, the production process of inorganic lightweight aggregate insulation board is quite different from that of ordinary concrete products. It is mainly a compression molding method, that is, the semi-dry materials that are mixed and stirred evenly are filled into the mold, and then pressed into shape with a hydraulic pressure head. The formed embryo body is steam-cured and dried before the final product is produced. This method is simple and fast, and the equipment operation is easy to use. It is the most suitable production process at present. But, the inorganic light aggregate insulation board that this method produces still has unsatisfactory part. [0003] The first is the problem of surface sanding. Because the inorganic light aggregate insulation board needs to reduce its own density to improv...

Claims

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Application Information

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IPC IPC(8): C04B28/00B32B9/00B32B9/04B32B33/00B28B13/02B28B3/00B28B11/24
CPCC04B28/00B32B9/00B32B9/04B32B33/00B28B13/02B28B3/00B28B11/24C04B2111/00612C04B2201/32C04B2201/50C04B14/185C04B2103/0068C04B2103/65C04B18/067
Inventor 王小山屠浩驰宋志龙李辉
Owner 宁波荣山材料科技有限公司