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A three-dimensional heterogeneous integrated packaging structure of a radio frequency front-end module and a manufacturing method thereof

A radio frequency front-end and integrated packaging technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as electromagnetic interference, lead parasitic effects, and miniaturization difficulties

Active Publication Date: 2022-08-02
NAT CENT FOR ADVANCED PACKAGING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the problems of miniaturization difficulty, gallium arsenide chip air bridge damage, wire parasitic effect after wire bonding, low heat dissipation efficiency and serious electromagnetic interference existing in the two-dimensional plane integration of the existing radio frequency front-end module, according to the present invention An embodiment provides a three-dimensional heterogeneous integrated packaging structure of a radio frequency front-end module, including:

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  • A three-dimensional heterogeneous integrated packaging structure of a radio frequency front-end module and a manufacturing method thereof
  • A three-dimensional heterogeneous integrated packaging structure of a radio frequency front-end module and a manufacturing method thereof
  • A three-dimensional heterogeneous integrated packaging structure of a radio frequency front-end module and a manufacturing method thereof

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Embodiment Construction

[0045] In the following description, the invention is described with reference to various embodiments. However, one skilled in the art will recognize that the various embodiments may be practiced without one or more of the specific details or with other alternative and / or additional methods, materials or components. In other instances, well-known structures, materials, or operations are not shown or described in detail so as not to obscure aspects of the various embodiments of the invention. Similarly, for purposes of explanation, specific quantities, materials and configurations are set forth in order to provide a thorough understanding of the embodiments of the invention. However, the present invention may be practiced without the specific details. Furthermore, it is to be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0046] In this specification, reference to "one embodiment" or "th...

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Abstract

The invention discloses a three-dimensional heterogeneous integrated packaging structure of a radio frequency front-end module, comprising: a first dielectric substrate, a first dielectric layer, a metal substrate, a second dielectric layer, a second dielectric substrate, and a first passive element embedded groove , the first active chip buried groove, the second passive element buried groove, the second active chip buried groove, the metal base through hole, the first passive element, the second passive element, the first active chip , a second active chip, a first conductive via, a second conductive via, a third conductive via, a chip pad, a first metal wiring layer, and a second metal wiring layer.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a three-dimensional heterogeneous integrated packaging structure of a radio frequency front-end module and a manufacturing method thereof. Background technique [0002] At present, the integration of RF front-end modules mainly relies on surface assembly technology to realize two-dimensional planar integration of active and passive components that constitute RF front-end modules on organic substrates or low-temperature co-fired ceramic substrates. [0003] However, with the development of 5G mobile communication, the introduction of new operating frequency bands and communication modes promotes the development of RF front-end modules in the direction of multi-device and multi-link. Therefore, the number of active and passive components required to be integrated will be multiply. Obviously, the current flat-integrated packaging form is not conducive to the miniatu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/16H01L21/98H01L21/50H01L23/14H01L23/367H01L23/373H01L23/498H01L23/552H01L23/66
CPCH01L25/162H01L25/50H01L21/50H01L23/142H01L23/49827H01L23/49838H01L23/367H01L23/3736H01L23/552H01L23/66H01L2223/6616H01L2924/15153H01L2224/16227H01L2224/32225H01L2224/73253H01L2224/73267H01L2224/04105H01L2224/24195H01L2924/15192H01L2224/92144H01L2224/92244
Inventor 薛梅王启东宋阳王文杰曹立强
Owner NAT CENT FOR ADVANCED PACKAGING CO LTD