Solder wire externally provided with soldering flux coating and preparation method of solder wire

A solder wire and flux technology, used in welding equipment, welding media, manufacturing tools, etc., can solve the problems of easy falling off of the flux coating, poor adhesion of the coating, easy falling off of the coating, etc. Excellent thermoplasticity, reducing the effect of empty welding and bridging

Active Publication Date: 2021-05-07
SHENZHEN XINGHONGTAI TIN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the flux coating prepared by common carriers and flux activators has poor compatibility with tin solder alloys, and the formed coating has poor adhesion, especially in alkaline and hygroscopic environment

Method used

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  • Solder wire externally provided with soldering flux coating and preparation method of solder wire
  • Solder wire externally provided with soldering flux coating and preparation method of solder wire
  • Solder wire externally provided with soldering flux coating and preparation method of solder wire

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0039]Examples 1-11 provide a method for preparing solder wires having a flux coating, and below is illustrated in Example 1.

[0040]Example 1 A method of preparing solder wire having a flux coating provided by an externally, which is:

[0041](1) Will SN96.5AG3.0CU0.5Put the extruder, set the parameters of the extruder: the temperature of the rock bucket is set to 125 ° C, the rosin catheter temperature is set to 130 ° C, the front beam temperature of the extruder is set to 60 ° C, the extrusion speed is set to 5 minutes a tin Silk, a tin alloy metal having a diameter of 0.8 mm, and weigh the quality of each tin alloy wire;

[0042](2) 6 g of dipropylene glycol methyl ether, 3 g of dipropylene glycol ether and 0.8 g of n-butyl ether were mixed to 65 ° C and held for 1 h, and then 20 g of polyamide wax sunmide 50, stirred well, and finally 15 g of methylcellulose ( The viscosity of 2 wt% at 20 ° C was 1400 MPa.s) and 25 g of ethylcellulose (DS of 48.5), stirred to completely dissolved, and ...

Example Embodiment

[0046]Example 2-4, with embodiment 1, the difference is only that the reaction parameter setting of each step is different, and Table 2 is specifically shown.

[0047]Table 2

[0048]

[0049]Example 5-6, with Example 4, the difference is only that the quality of the raw materials of each step is different, and Table 3 is shown in Table 3.

[0050]table 3

[0051]

Example Embodiment

[0052]Example 7, with Example 6, the difference is only that the methylcellulose (2 wt% of the aqueous solution of 20 ° C is 1400 MPa.s) is replaced with methylcellulose (2 wt% aqueous solution at 20 ° C). The viscosity is 4500 MPa.s).

[0053]Examples 8-10, in the same embodiment, the difference is only that the composition of the polyamide wax is different, and Table 4 is shown in Table 4.

[0054]Table 4

[0055]

[0056]

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Abstract

The invention relates to a soldering technology, in particular to a solder wire externally provided with a soldering flux coating and a preparation method of the solder wire. The preparation method of the solder wire externally provided with the soldering flux coating comprises the following steps that S1, a tin alloy wire is formed from a tin solder alloy under the action of an extruder; S2, soldering flux is subjected to heating treatment at the temperature of 90-110 DEG C; and S3, the tin alloy wire in the step S1 is coated with the soldering flux treated in the step S2, solidification is conducted under cold air at the temperature of 0-10 DEG C, and the solder wire externally provided with the soldering flux coating is formed. According to the solder wire with the soldering flux coated on the surface of the tin alloy wire, the soldering flux alloy on the outer layer of the soldering flux cannot be exploded instantly, the soldering flux cannot splash and cannot form tin beads during tin soldering, a welded part is clean and tidy after tin soldering, and the function of an electronic appliance is not affected.

Description

technical field [0001] The application relates to soldering technology, in particular to a soldering wire with a flux coating on the outside and a preparation method thereof. Background technique [0002] With the vigorous development of the electronics industry and the improvement of light weight, miniaturization and miniaturization of electronic products, the quality requirements of electronic products are more stringent, especially the emergence of environmentally friendly products, requiring the gradual replacement of tin-lead solder by lead-free solder. The current development of lead-free solder is very fast, especially lead-free ultra-fine wire. In electronic packaging, solder wire is a common soldering material for manual soldering or semi-automatic machine soldering. Solder wire is commonly used to electrically or mechanically connect electronic devices and electronic components. [0003] In the application of soldering in the electronic and electrical industry, r...

Claims

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Application Information

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IPC IPC(8): B23K35/40B23K35/12
CPCB23K35/0272B23K35/40
Inventor 邢璧元王寿银王超邢璧凡
Owner SHENZHEN XINGHONGTAI TIN
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