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Solder wire externally provided with soldering flux coating and preparation method of solder wire

A solder wire and flux technology, used in welding equipment, welding media, manufacturing tools, etc., can solve the problems of easy falling off of the flux coating, poor adhesion of the coating, easy falling off of the coating, etc. Excellent thermoplasticity, reducing the effect of empty welding and bridging

Active Publication Date: 2021-05-07
SHENZHEN XINGHONGTAI TIN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the flux coating prepared by common carriers and flux activators has poor compatibility with tin solder alloys, and the formed coating has poor adhesion, especially in alkaline and hygroscopic environments, and the flux coating is easy to fall off.
[0005] In view of the above-mentioned related technologies, the current solder wire with flux coating on the outside has the problem that the coating is easy to fall off

Method used

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  • Solder wire externally provided with soldering flux coating and preparation method of solder wire
  • Solder wire externally provided with soldering flux coating and preparation method of solder wire
  • Solder wire externally provided with soldering flux coating and preparation method of solder wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Embodiments 1-11 provide a method for preparing a solder wire with a flux coating on the outside, which will be described below by taking Embodiment 1 as an example.

[0040] A kind of preparation method of the solder wire with flux coating on the outside that embodiment 1 provides, its steps are:

[0041] (1) Sn 96.5 Ag 3.0 Cu 0.5 Put it into the extruder and set the parameters of the extruder: the temperature of the rosin barrel is set to 125°C, the temperature of the rosin conduit is set to 130°C, the temperature of the front beam of the extruder is set to 60°C, and the extrusion speed is set to 5 minutes per tin wire, to get a tin alloy wire with a diameter of 0.8mm, and take the quality of each tin alloy wire;

[0042] (2) Mix 6g of dipropylene glycol methyl ether, 3g of dipropylene glycol ethyl ether and 0.8g of n-butyl ether, heat to 65°C and keep it warm for 1h, then add 20g of polyamide wax SUNMIDE 50, stir evenly, and finally add 15g of methyl cellulose ( ...

Embodiment 2-4

[0046] Examples 2-4 are the same as Example 1, except that the reaction parameters of each step are set differently, see Table 2 for details.

[0047] Table 2

[0048]

[0049] Examples 5-6 are the same as Example 4, except that the quality of raw materials in each step is different, see Table 3 for details.

[0050] table 3

[0051]

Embodiment 7

[0052] Embodiment 7, with embodiment 6, difference is only: the viscosity of described methylcellulose (2wt% aqueous solution when 20 ℃ is 1400mPa.s) is replaced by methylcellulose (2wt% aqueous solution when 20 ℃ The viscosity is 4500mPa.s).

[0053] Examples 8-10 are the same as Example 7, except that the composition of the polyamide wax is different, see Table 4 for details.

[0054] Table 4

[0055]

[0056]

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Abstract

The invention relates to a soldering technology, in particular to a solder wire externally provided with a soldering flux coating and a preparation method of the solder wire. The preparation method of the solder wire externally provided with the soldering flux coating comprises the following steps that S1, a tin alloy wire is formed from a tin solder alloy under the action of an extruder; S2, soldering flux is subjected to heating treatment at the temperature of 90-110 DEG C; and S3, the tin alloy wire in the step S1 is coated with the soldering flux treated in the step S2, solidification is conducted under cold air at the temperature of 0-10 DEG C, and the solder wire externally provided with the soldering flux coating is formed. According to the solder wire with the soldering flux coated on the surface of the tin alloy wire, the soldering flux alloy on the outer layer of the soldering flux cannot be exploded instantly, the soldering flux cannot splash and cannot form tin beads during tin soldering, a welded part is clean and tidy after tin soldering, and the function of an electronic appliance is not affected.

Description

technical field [0001] The application relates to soldering technology, in particular to a soldering wire with a flux coating on the outside and a preparation method thereof. Background technique [0002] With the vigorous development of the electronics industry and the improvement of light weight, miniaturization and miniaturization of electronic products, the quality requirements of electronic products are more stringent, especially the emergence of environmentally friendly products, requiring the gradual replacement of tin-lead solder by lead-free solder. The current development of lead-free solder is very fast, especially lead-free ultra-fine wire. In electronic packaging, solder wire is a common soldering material for manual soldering or semi-automatic machine soldering. Solder wire is commonly used to electrically or mechanically connect electronic devices and electronic components. [0003] In the application of soldering in the electronic and electrical industry, r...

Claims

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Application Information

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IPC IPC(8): B23K35/40B23K35/12
CPCB23K35/0272B23K35/40
Inventor 邢璧元王寿银王超邢璧凡
Owner SHENZHEN XINGHONGTAI TIN
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