Wafer double-side scrubbing facility

Abstract

The invention discloses a wafer double-side scrubbing facility which comprises a box body, a material moving assembly, overturning assemblies and processing assemblies, wherein the material moving assembly, the overturning assemblies and the processing assemblies are located in the box body. Each overturning assembly comprises an overturning motor, an overturning clamping air cylinder driven by the overturning motor and a clamping block located at the moving end of the overturning clamping air cylinder, wherein a clamping groove is formed in each clamping block. Each processing assembly comprises a scrubbing part and a spin-drying part. Each scrubbing part comprises a scrubbing box body, a suction disc located in the scrubbing box body, a scrubbing driving motor located at the bottom of the suction disc and a scrubbing head located in the scrubbing box body. Each spin-drying part comprises a spin-drying box body, a positioning disc located in the spin-drying box body and a spin-drying driving motor located at the bottom of the positioning disc. According to the wafer double-side scrubbing facility, double-side scrubbing of a wafer is achieved, the manpower consumption is reduced, the scrubbing efficiency is improved, the wafer cannot be damaged, the scrubbing effect is guaranteed, and the subsequent usage of the wafer cannot be affected.

Description

technical field [0001] The invention belongs to the technical field of wafer scrubbing, in particular to a double-sided wafer scrubbing device. Background technique [0002] Silicon carbide wafers are mainly used in the field of LED solid-state lighting and high-frequency devices. The material has excellent characteristics such as band gap, drift speed, breakdown voltage, thermal conductivity, and high temperature resistance that are several times higher than traditional silicon. It has irreplaceable advantages in application fields and extreme environment applications such as aerospace, military industry, and nuclear energy. [0003] After using a silicon carbide wafer for a period of time, it is often necessary to clean both sides of the silicon carbide wafer. Generally, the operation is performed manually, that is, the operator cleans both sides of the silicon carbide wafer one by one. This method requires a lot of manpower and is inefficient. , it is easy to cause dama...

AI Technical Summary

Problems solved by technology

[0003] After using a silicon carbide wafer for a period of time, it is often necessary to clean both sides of the silicon carbide wafer. Generally, the operation is performed manually, that is, the operator cleans both sides of the silicon carbide wafer one by one. This method requires a lot of manpower and is inefficient. , it is easy to cause damage to the silicon carbide wafer, and the manual cleaning effect is poor, which will easily affect the subsequent use of the silicon carbide wafer

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