Substrate preparation method and substrate structure, chip packaging method and chip packaging structure

Abstract

The present invention discloses a substrate preparation method and substrate structure, chip packaging method and chip packaging structure, including: provides the first glass substrate, which is embedded in several electrical colums in it, and the surface of the electrical column and the surface of the first glass substrateFacing, the other end is protruding the first glass substrate to form a convex, the first sub -substrate is made; the second glass substrate with thickness and the length of the convector is provided.Open a number of holes in the inside, make the first wiring layer in the line groove, and make the perforated pores, and the second child substrate is made;In the holes, the surface of the conversion end surface is flat with the surface of the second glass substrate.The stability of the line interconnection of the substrate structure made of this method is easy to install the chip. It can avoid the opening of the substrate structure and the inside of the substrate structure after installing the chip.Increase product yield.

Description

technical field

[0001] The invention relates to the technical field of integrated circuits, in particular to a substrate preparation method and substrate structure, a chip packaging method and a chip packaging structure. Background technique

[0002] With the trend of miniaturization and integration of electronic products, the high density of microelectronic packaging technology has gradually become the mainstream in the new generation of electronic products. In order to adapt to the development of a new generation of electronic products, especially the development of mobile phones, notebooks, smart wearable devices and other products, chips are developing in the direction of higher density, faster speed, smaller size and lower cost.

[0003] During the packaging process, due to the difference in thermal expansion coefficients of plastic, silicon and metal materials, the volume changes of these materials are not synchronized, resulting in stress and warpage. Among them, the...

Examples

Embodiment 1

[0082] The chip packaging method of this embodiment includes the following steps:

[0083] S10, prepare the first sub-substrate:

[0084] S10a, providing a first glass substrate 11, pasting a first photosensitive dry film on one side of the first glass substrate 11, and forming several windows after exposure and development;

[0085] S10b, opening a TGV through hole 12 in the window for the first glass substrate 11, refer to figure 1 ;

[0086] S10c, forming conductive pillars 13 in the TGV through hole 12, making one end surface of the conductive pillar 13 flush with the surface of the first glass substrate 11, and making the other end surface of the conductive pillar 13 protrude from the first glass substrate 11 Form bosses, refer to figure 2 ;

[0087] S10d, removing the remaining first photosensitive dry film.

[0088] S20, prepare the second sub-substrate:

[0089] S20a, providing the second glass substrate 21 with the same thickness as the boss length, and designi...

Embodiment 2

[0120] The chip packaging method of this embodiment is basically the same as that of the above-mentioned first embodiment (for the drawings, please refer to the drawings in the above-mentioned first embodiment, and the same reference numerals are used for the same components), and the difference lies in step S20a and step S30:

[0121] S20a, provide the second glass substrate 21, design the opening area of ​​the circuit groove 22 and the opening position of the via hole 23 in the circuit groove 22 according to the circuit of the first redistribution layer 24 and the position of the conductive column 13, and then carry out laser focusing modification After modification, ammonium hydrogen fluoride solution is used for immersion to etch the laser focused modified area, so as to open a circuit groove 22 on one side of the second glass substrate 21 and open a line through the second glass substrate 22 in the circuit groove 22. Vias 23 of the substrate 21 .

[0122] S30, the first s...

technical field

[0001] The invention relates to the technical field of integrated circuits, in particular to a substrate preparation method and substrate structure, a chip packaging method and a chip packaging structure. Background technique

[0002] With the trend of miniaturization and integration of electronic products, the high density of microelectronic packaging technology has gradually become the mainstream in the new generation of electronic products. In order to adapt to the development of a new generation of electronic products, especially the development of mobile phones, notebooks, smart wearable devices and other products, chips are developing in the direction of higher density, faster speed, smaller size and lower cost.

[0003] During the packaging process, due to the difference in thermal expansion coefficients of plastic, silicon and metal materials, the volume changes of these materials are not synchronized, resulting in stress and warpage. Among them, the...

Examples

Embodiment 1

[0082] The chip packaging method of this embodiment includes the following steps:

[0083] S10, prepare the first sub-substrate:

[0084] S10a, providing a first glass substrate 11, pasting a first photosensitive dry film on one side of the first glass substrate 11, and forming several windows after exposure and development;

[0085] S10b, opening a TGV through hole 12 in the window for the first glass substrate 11, refer to figure 1 ;

[0086] S10c, forming conductive pillars 13 in the TGV through hole 12, making one end surface of the conductive pillar 13 flush with the surface of the first glass substrate 11, and making the other end surface of the conductive pillar 13 protrude from the first glass substrate 11 Form bosses, refer to figure 2 ;

[0087] S10d, removing the remaining first photosensitive dry film.

[0088] S20, prepare the second sub-substrate:

[0089] S20a, providing the second glass substrate 21 with the same thickness as the boss length, and designi...

Embodiment 2

[0120] The chip packaging method of this embodiment is basically the same as that of the above-mentioned first embodiment (for the drawings, please refer to the drawings in the above-mentioned first embodiment, and the same reference numerals are used for the same components), and the difference lies in step S20a and step S30:

[0121] S20a, provide the second glass substrate 21, design the opening area of ​​the circuit groove 22 and the opening position of the via hole 23 in the circuit groove 22 according to the circuit of the first redistribution layer 24 and the position of the conductive column 13, and then carry out laser focusing modification After modification, ammonium hydrogen fluoride solution is used for immersion to etch the laser focused modified area, so as to open a circuit groove 22 on one side of the second glass substrate 21 and open a line through the second glass substrate 22 in the circuit groove 22. Vias 23 of the substrate 21 .

[0122] S30, the first s...

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