Preparation method of surface acoustic wave transducer with temperature compensation function
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A technology of temperature compensation and surface acoustic wave, applied in the direction of electrical components, impedance networks, etc., can solve the problems of inflexibility in process and design, limit the development of TCSAW, poor communication signals, etc., and achieve easy large-scale promotion and shorten the slow speed Deposition process, effect of reducing processing time
Active Publication Date: 2021-05-14
SHOULDER ELECTRONICS CO LTD
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However, the current electro-acoustic transducers using traditional technology will have the problem of frequency drift when the temperature changes
Under the current situation that the communication frequency band is becoming more and more compact, when the communication equipment is used in different temperature environments, it is very easy to have an abnormal series frequency, which leads to poor communication signals.
Therefore, the TCSAW (Temperature Compensated Surface Acoustic Wave) device with temperature compensation function has been proposed in the international academic community, using SiO 2 The dielectric fills the upper layer of the IDT of the traditional SAW device, but these solutions are all single-layer SiO 2 Medium, inflexible in process and design, limits the development of TCSAW technology
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Embodiment 1
[0039] A method for preparing a surface acoustic wave transducer with a temperature compensation function, comprising the steps of:
[0040] Step 1, such as Figure 6 As shown in (a), the piezoelectric substrate 1 is obtained and the surface is cleaned. Piezoelectric substrate 1 uses 128°YX-LiNbO with high electromechanical coupling coefficient 3 wafer.
[0041] Step 2, preparing an interdigital transducer on the piezoelectric substrate 1 by photolithography, evaporation, stripping and other processes.
[0042] The interdigital transducer includes a first interdigital structure and a second interdigital structure arranged oppositely, and a first bus bar connected to the comb handle part of the first interdigital structure and a comb handle part connected to the second interdigital structure Connected second bus bars, each interdigitated structure is respectively placed between two adjacent electrode fingers of another interdigitated structure without touching each other, th...
Embodiment 2
[0053] A method for preparing another surface acoustic wave transducer with a temperature compensation function, comprising the following steps:
[0054] Step 1. Obtain the piezoelectric substrate 1 and clean the surface. Piezoelectric substrate 1 uses 42°YX-LiTaO with high electromechanical coupling coefficient 3 wafer.
[0055] Step 2, preparing an interdigital transducer on the piezoelectric substrate 1 by photolithography, evaporation, stripping and other processes.
[0056] The structure of the IDT is the same as that of Embodiment 1, and will not be repeated here. Specifically, combine image 3 , Figure 4 , Figure 6 As shown in (b), the period length λ of the interdigital electrodes of the interdigital transducer is set to 3.8-4.2um, and the metallization ratio of the interdigital electrodes in the interdigital region is 0.52. The first interdigital structure includes the first interdigital electrode I2 and the first interdigital electrode II7, and the second int...
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Abstract
The invention discloses a preparation method of a surface acoustic wave transducer with a temperature compensation function, and relates to the field of surface acoustic wave device manufacturing, and the method comprises the steps: preparing an interdigital transducer on a piezoelectric substrate, wherein the interdigital transducer comprises a first interdigital structure and a second interdigital structure which are oppositely crossed, the two interdigital structures are the same and each comprise a first-type interdigital electrode and a second-type interdigital electrode serving as a sacrificial layer; preparing a first temperature compensation dielectric film on a piezoelectric substrate, wherein the profile morphology of the first temperature compensation dielectric film has the characteristics that the upper part of an electrode protrudes and the upper part of a gap between adjacent electrode fingers is flat; reducing the film thickness of the first temperature compensation dielectric film to be close to the thickness of the first-type interdigital electrode to form a first temperature compensation dielectric layer; corroding and stripping the sacrificial layer; and preparing a second temperature compensation dielectric layer on the surfaces of the first-type interdigital electrode and the first temperature compensation dielectric layer. The surface appearance of the medium is controlled by using a sacrificial layer technology, and the insertion loss is reduced and the performance of the surface acoustic wave transducer is improved through the control over the double-layer medium.
Description
technical field [0001] The invention relates to the field of surface acoustic wave device manufacturing, in particular to a surface acoustic wave resonator or filter required for signal processing of wireless communication equipment, specifically a surface acoustic wave transducer with a temperature compensation function The preparation method of the device. Background technique [0002] Surface Acoustic Wave (SAW) technology is a radio frequency electronic discipline that combines acoustics, electronics, piezoelectric materials and semiconductor planar technology. Since the SAW transducer works in the radio frequency band, the SAW transducer has the unique advantages of low electro-acoustic conversion loss, flexible design and easy fabrication, so it is widely used and is an important part of various SAW devices. [0003] Radio frequency filters play a vital role in communication equipment and terminals. It can filter out out-of-band interference and noise to meet the requ...
Claims
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