Method for manufacturing circuit of circuit board through laser etching
A technology of circuit board circuit and laser etching, which is applied in the direction of printed circuit manufacturing, printed circuit, and removal of conductive materials through light, and can solve problems such as complex manufacturing process
Pending Publication Date: 2021-05-18
SHENZHEN BAROY NEW MATERIAL TECH CO LTD
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Problems solved by technology
[0004] The purpose of the present invention is to provide a method for manufacturing laser-etched circuit board circuits, aiming to solve the technical problem of complex manufacturing process in the existing circuit board manufacturing method
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[0033] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0034] It should be noted that when a component is referred to as being “fixed on” or “disposed on” another component, it may be directly or indirectly located on the other component. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. The indicated orientation or position is based on the orientation or position shown in the drawings, and is only for convenience of description, and sho...
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Abstract
The invention is applicable to the technical field of circuit boards, and provides a method for manufacturing a circuit of a circuit board through laser etching, which comprises the following steps of: pressing conductive copper foil on a base material to form a copper-clad plate; performing laser etching on the copper-clad plate by using a laser engraving machine, laminating the conductive copper foil to form a conductive copper layer, etching a groove on the conductive copper layer, and reserving the conductive copper layer with a certain thickness at the bottom of the groove; putting the copper-clad plate subjected to laser etching into a vacuum two-fluid etching device, and etching the conductive copper layer to form a circuit interval; performing laser etching by using a laser engraving machine to form a groove with a fine circuit on the conductive copper layer; and carrying out etching through a vacuum two-fluid etching device, so that the residual conductive copper layer in the groove can be etched to form a circuit interval, and a required circuit pattern is completed. Through the preparation method, the processes of film manufacturing, photosensitive film pasting, exposure and development, electroplating, film stripping and the like are reduced; therefore, the circuit board has the characteristics of simple preparation process flow, less material consumption and short production period.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing circuit board circuits by laser etching. Background technique [0002] With the development of the electronics industry, electronic products have entered the stage of functional and intelligent development. In order to meet the needs of high integration, miniaturization and miniaturization of electronic products, on the premise of satisfying the good electrical and thermal properties of electronic products , The circuit board is also developing towards the design trend of light, thin, short and small. With the gradual reduction of design size, the interconnection density of all products at the design level continues to increase, that is, in an increasingly limited area, more input and output signal lines need to be designed, and the circuit board lines are also required to be more and more The finer it is. [0003] At present, the process flow ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K3/02
CPCH05K3/027H05K2203/0361
Inventor 孙伟张光辉
Owner SHENZHEN BAROY NEW MATERIAL TECH CO LTD