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Stamp for fine circuit printing and printing method

A technology of circuit printing and printing method, which is applied in the stamp and printing field of fine circuit printing, can solve the problems of low efficiency, high preparation cost, and no potential for large-scale industrialization, so as to avoid equipment vibration, improve printing effect, and maintain stability sexual effect

Active Publication Date: 2021-05-25
广东绿展科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem with this technology is that this fine hydrophilic-hydrophobic structure is generally completed by exposure / development methods, which is expensive to prepare, or inefficient, and has no potential for large-scale industrialization

Method used

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  • Stamp for fine circuit printing and printing method
  • Stamp for fine circuit printing and printing method
  • Stamp for fine circuit printing and printing method

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Experimental program
Comparison scheme
Effect test

preparation example Construction

[0102] The invention realizes dry printing in the preparation of hydrophilic and hydrophobic graphics, that is, no ink is needed at all, and graphic aliasing caused by spontaneous movement of ink is fundamentally avoided. Moreover, the present invention adopts dry printing to form hydrophilic and hydrophobic patterns, and the line width of the hydrophilic and hydrophobic patterns is less than 1 mm, even as small as 1-50 μm, which can realize the printing of fine circuits with high resolution.

[0103] However, although the present invention can obtain a hydrophilic-hydrophobic pattern with an excellent hydrophobic effect through the above-mentioned preparation method, the formation mechanism of the hydrophilic-hydrophobic pattern is still not very clear. In order to verify the mechanism, the following step-by-step experiments were carried out:

[0104] 1. Experimental materials: PDMS is used for the seal, and glass is used for the substrate.

[0105] 2. Experimental process: ...

Embodiment 1

[0120](1) Preparation of the stamp: A. Preparation of the printing layer: Put the cleaned and hydrophobized template with a microstructure in the container, and prepare 0.1mm 10:1 PDMS by spin coating or drop coating Precursor mixed solution (Dow Corning Sylgard 184), after standing still to eliminate air bubbles, perform normal temperature or heating curing operation, the time is 50% to 90% of the complete curing time. B. Preparation of stamp body: pour 25:1 PDMS precursor mixture (Dow Corning Sylgard184) with a thickness of 5 mm on the surface of 5:1 PDMS, and after standing still to eliminate air bubbles, carry out normal temperature or heating curing operation until it is completely cured. C, demoulding, obtain the seal body and the printing layer that are connected as one structure. The modulus ratio between the printing layer and the stamp body in this embodiment is about 2.66:1.

[0121] (2) Use glass as the substrate;

[0122] (3) The substrate is subjected to strong...

Embodiment 2

[0127] (1) Preparation of the stamp: A. Preparation of the printing layer: Put the cleaned and hydrophobized template with a microstructure in the container, and prepare a 0.2mm 5:1 by spin coating or drop coating The PDMS precursor mixture (Dow Corning Sylgard 184), after standing still to eliminate air bubbles, is cured at room temperature or heated, and the time is 50% to 90% of the complete curing time. B. Preparation of the stamp body: pour a 33:1 PDMS precursor mixture (Dow Corning Sylgard 184) with a thickness of 6mm on the surface of 5:1 PDMS. After standing still to eliminate air bubbles, carry out normal temperature or heating curing operation until it is completely cured . C, demoulding, obtain the seal body and the printing layer that are connected as one structure. In this embodiment, the modulus ratio between the printing layer and the stamp body is about 6.41:1.

[0128] (2) Use glass as the substrate;

[0129] (3) Perform strong oxidation treatment on the su...

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Abstract

The invention discloses a stamp for fine circuit printing. The stamp comprises a stamp body and a printing layer; the printing layer is made of -O-Si-R group-containing silicone rubber; the stamp body and the printing layer form an integrated structure through bonding; the printing layer is provided with a microstructure for forming hydrophilic and hydrophobic patterns; the elastic modulus of the stamp body is smaller than that of the printing laye; and the ratio of the elastic modulus of the printing layer to the elastic modulus of the stamp body is (2-200): 1. Correspondingly, the invention further provides a printing method of the fine circuit using the stamp. By adopting the stamp and the printing method, the hydrophilic and hydrophobic patterns can be copied largely at low cost, and then the spontaneous movement of conductive ink before drying can be controlled, so that a finer conductive pattern is obtained, and the probability of accidental short circuiting is reduced.

Description

technical field [0001] The invention relates to the technical field of circuit printing, in particular to a stamp and printing method for fine circuit printing. Background technique [0002] The integrated and low-cost manufacturing of circuits is the main trend of industrial development. The printing processing method has its unique advantages in the manufacture of some electronic products with its simplified process and low cost. It is expected to be used in some circuits with low integration. widely used in manufacturing. For example, screen printing electrodes have become the standard process for photovoltaic cell production all over the world, and inkjet printing has become the mainstream technology for flexible OLED thin film packaging. [0003] In the past few decades, integrated circuits (including circuit boards and chips, etc.) have mainly subtractive standard processes, including a series of complex processing steps such as photolithography, development, and etch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41K1/02B41K1/38B41M5/00H05K3/12
CPCB41K1/02B41K1/38B41M5/0047B41M5/0064H05K3/12
Inventor 林剑马昌期曾超邢建博
Owner 广东绿展科技有限公司