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Stamp and printing method for fine circuit printing

A circuit printing and printing method technology, applied in the field of fine circuit printing stamps and printing, can solve the problems of no potential for large-scale industrialization, high production costs, low efficiency, etc., to improve the printing effect, maintain stability, and avoid equipment. The effect of vibration

Active Publication Date: 2021-11-05
广东绿展科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem with this technology is that this fine hydrophilic-hydrophobic structure is generally completed by exposure / development methods, which is expensive to prepare, or inefficient, and has no potential for large-scale industrialization

Method used

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  • Stamp and printing method for fine circuit printing
  • Stamp and printing method for fine circuit printing
  • Stamp and printing method for fine circuit printing

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Experimental program
Comparison scheme
Effect test

preparation example Construction

[0102] The invention realizes dry printing in the preparation of hydrophilic and hydrophobic graphics, that is, no ink is needed at all, and graphic aliasing caused by spontaneous movement of ink is fundamentally avoided. Moreover, the present invention adopts dry printing to form hydrophilic and hydrophobic patterns, and the line width of the hydrophilic and hydrophobic patterns is less than 1 mm, even as small as 1-50 μm, which can realize the printing of fine circuits with high resolution.

[0103] However, although the present invention can obtain a hydrophilic-hydrophobic pattern with an excellent hydrophobic effect through the above-mentioned preparation method, the formation mechanism of the hydrophilic-hydrophobic pattern is still not very clear. In order to verify the mechanism, the following step-by-step experiments were carried out:

[0104] 1. Experimental materials: PDMS is used for the seal, and glass is used for the substrate.

[0105] 2. Experimental process: ...

Embodiment 1

[0120](1) Preparation of the stamp: A. Preparation of the printing layer: Put the cleaned and hydrophobized template with a microstructure in the container, and prepare a 0.1mm 10:1 by spin coating or drop coating PDMS precursor mixture (Dow Corning Sylgard 184), after standing still to eliminate air bubbles, perform room temperature or heating curing operation, the time is 50%~90% of the complete curing time. B. Preparation of the stamp body: pour a 25:1 PDMS precursor mixture (Dow Corning Sylgard 184) with a thickness of 5mm on the surface of 5:1 PDMS, and after standing to eliminate air bubbles, carry out room temperature or heating curing operation until it is completely cured . C, demoulding, obtain the seal body and the printing layer that are connected as one structure. The modulus ratio between the printing layer and the stamp body in this embodiment is about 2.66:1.

[0121] (2) Use glass as the substrate;

[0122] (3) Perform a strong oxidation treatment on the su...

Embodiment 2

[0127] (1) Preparation of the stamp: A. Preparation of the printing layer: Put the cleaned and hydrophobized template with a microstructure in the container, and prepare a 0.2mm 5:1 by spin coating or drop coating PDMS precursor mixture (Dow Corning Sylgard 184), after standing still to eliminate air bubbles, perform room temperature or heating curing operation, the time is 50%~90% of the complete curing time. B. Preparation of the stamp body: pour a 33:1 PDMS precursor mixture (Dow Corning Sylgard 184) with a thickness of 6mm on the surface of 5:1 PDMS. After standing still to eliminate air bubbles, carry out normal temperature or heating curing operation until it is completely cured . C, demoulding, obtain the seal body and the printing layer that are connected as one structure. In this embodiment, the modulus ratio between the printing layer and the stamp body is about 6.41:1.

[0128] (2) Use glass as the substrate;

[0129] (3) Perform strong oxidation treatment on the...

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Abstract

The invention discloses a stamp for fine circuit printing. The stamp includes a stamp body and a printing layer, and the printing layer is made of silicone rubber containing -O-Si-R groups; the stamp body and printing Layers are formed by bonding to form an integrated structure, and the printing layer is provided with a microstructure for forming hydrophilic and hydrophobic graphics; the modulus of elasticity of the stamp body is smaller than that of the printing layer, and the elasticity of the printing layer The ratio of the modulus to the elastic modulus of the stamp body is (2‑200):1. Correspondingly, the present invention also provides a printing method of a fine circuit using the above-mentioned stamp. By adopting the invention, a large number of hydrophilic and hydrophobic patterns can be copied at low cost, and then the spontaneous movement of conductive ink before drying can be controlled, thereby obtaining finer conductive patterns and reducing the probability of accidental short circuit.

Description

technical field [0001] The invention relates to the technical field of circuit printing, in particular to a stamp and printing method for fine circuit printing. Background technique [0002] The integrated and low-cost manufacturing of circuits is the main trend of industrial development. The printing processing method has its unique advantages in the manufacture of some electronic products with its simplified process and low cost. It is expected to be used in some circuits with low integration. widely used in manufacturing. For example, screen printing electrodes have become the standard process for photovoltaic cell production all over the world, and inkjet printing has become the mainstream technology for flexible OLED thin film packaging. [0003] In the past few decades, integrated circuits (including circuit boards and chips, etc.) have mainly subtractive standard processes, including a series of complex processing steps such as photolithography, development, and etch...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41K1/02B41K1/38B41M5/00H05K3/12
CPCB41K1/02B41K1/38B41M5/0047B41M5/0064H05K3/12
Inventor 林剑马昌期曾超邢建博
Owner 广东绿展科技有限公司