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Temperature control device with a plurality of electrically conductive terminals, and an optical subassembly module implementing same

A temperature control device and terminal technology, applied in the direction of optical components, electrical components, semiconductor lasers, etc., can solve the problems of size reduction, orientation and electrical interconnection complexity

Pending Publication Date: 2021-05-25
APPLIED OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, continued scaling and increasing channel densities create several technical challenges that complicate monitoring photodiode placement, orientation, and electrical interconnection

Method used

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  • Temperature control device with a plurality of electrically conductive terminals, and an optical subassembly module implementing same
  • Temperature control device with a plurality of electrically conductive terminals, and an optical subassembly module implementing same
  • Temperature control device with a plurality of electrically conductive terminals, and an optical subassembly module implementing same

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Embodiment Construction

[0065] As noted above, the shrinking size of optical modules and subassemblies complicates the implementation and design of monitor photodiode configurations. This challenge can be better understood with an example. Figure 1A An exemplary can laser 100 is presented having an electro-absorption modulated laser (EML) configuration 104 and an associated monitor photodiode 106 . Electro-absorption modulation lasers are especially suitable for long-distance optical communication, such as up to or beyond 10 kilometers. However, maintaining rated performance with an EAM laser depends largely on the control of operating temperature. A temperature control device such as a thermoelectric cooler (TEC) can be used to maintain the target temperature.

[0066] Such as Figure 1A As shown, the can laser 100 includes a thermoelectric cooler 102 , and an EAM laser arrangement 104 is disposed on the thermoelectric cooler 102 . Additionally, a monitor photodiode 106 is mounted to the thermoel...

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PUM

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Abstract

In general, a temperature control device for use in laser assemblies and optical subassemblies is disclosed that includes at least two electrically conductive terminals to enable flexible electrical coupling to associated components, e.g., monitor photodiodes and laser diodes, and accommodate a range of laser assembly configurations without the necessity of supplying a negative voltage rail. In more detail, a temperature control device consistent with the present disclosure includes a bottom plate, a top plate, and a plurality of semiconductor elements disposed therebetween. The top plate includes a component mounting surface that provides at least a first and second electrically conductive terminal / pad. The first and second electrically conductive terminals / pads can be electrically isolated, e.g., via a gap, and configured to provide first and second voltage potentials respectively.

Description

technical field [0001] The present invention relates to an optical communication device, in particular to a temperature control device used in an optical subassembly. The temperature control device has two or more conductive terminals for coupling to related components and selectively providing The same or different potential (voltage potential). Background technique [0002] Optical transceivers can be used to send and receive optical signals for but not limited to various applications such as internet data center, cable TV broadband and fiber to the home (FTTH). For example, transmission with optical transceivers can provide higher speed and bandwidth over longer distances than transmission with cables made of copper. In order to provide higher speed in smaller optical transceiver modules, there are challenges such as space management and manufacturing yield. [0003] An optical transceiver module generally includes one or more transmitter optical subassemblies (TOSA) fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42H04B10/40H01S5/023H01S5/0233
CPCG02B6/4268G02B6/4271G02B6/4274G02B6/4286H04B10/40H01S5/0233H01S5/023G02B6/4246G02B6/4269H01S5/02212H01S5/02415H01S5/02325H01S5/0239H01S5/02476G02B6/0066H01S5/0235
Inventor 林恺声谢航齐明
Owner APPLIED OPTOELECTRONICS
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