Pressure-sensitive film and manufacturing method thereof

Abstract

The invention provides a pressure-sensitive film and a manufacturing method thereof, the pressure-sensitive film comprises: a substrate, wherein the substrate is provided with at least one pressure-sensitive resistor and a connecting line between the pressure-sensitive resistors, the interval of a second insulating layer is longer than that of a first resistive layer, and the two ends of the second insulating layer coincide with a projection part of the first resistive layer in the vertical direction; and a second resistive layer abutted on the second insulating layer, wherein the length of the second resistive layer is larger than that of the second insulating layer, end parts are formed at the two ends of the second resistive layer, and the end parts are connected with the part, which is not overlapped with the projection of the second insulating layer in the vertical direction, in the first resistive layer, so that the second resistive layer is not influenced by the printing condition of the first resistive layer. According to the scheme, for the pressure-sensitive resistors, the precision is high, the consistency of the resistance values of the pressure-sensitive resistors forming the bridge circuit is better, and the phenomenon that offset voltage is generated in the bridge circuit due to the poor consistency of the pressure-sensitive resistors, and the voltage to be measured exceeds the measuring range of a measuring chip is avoided.

Description

technical field [0001] The present application relates to the field of pressure-sensitive touch, in particular to a pressure-sensitive film and a manufacturing method thereof. Background technique [0002] Nowadays, the pressure sensing devices of electronic equipment are designed to be thinner and thinner, so as to reduce the thickness of the sensing components so as to be installed in different working scenarios. Among them, the sensing component is converted from a capacitive sensing component to a piezoresistive or strain sensing component, and a piezoresistive or strain sensing component usually uses a pressure sensitive film. This kind of pressure-sensitive film adopts the form of Wheatstone bridge, and adopts single-arm, double-arm, and full-bridge circuits according to needs. The numbers of fixed resistors with resistance values ​​are 3, 2, and 0 respectively. When the piezoresistor is subjected to stress, the resistance value of the piezoresistor changes, while th...

AI Technical Summary

Problems solved by technology

Obviously, separate reflow soldering or laser for each resistor will increase the production process of the pressure-sensitive film on the substrate, which is not good for the production cycle; and as a pressure-sensitive film, it is usually printed on FPC (Flexible Printed Circuit, flexible circuit board) Or on the PCB circuit board, laser and other processes will cause breakdown of the FPC

In addition, the resistors in the above-mentioned prior art belong to the resistors with fixed resistance value, and generally pursue the resistance value accuracy of a single resistor, and only need the conductive ink of the same material for production

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