Power device module and manufacturing method thereof
A technology for power devices and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of large-scale application of unfavorable devices and high manufacturing costs
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[0043] The above is the core idea of the present invention. In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention Description, obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0044] An embodiment of the present invention provides a power device module, such as figure 1 shown, including:
[0045] a first doped semiconductor layer 10;
[0046] The second doped semiconductor layer 20 located on one side sur...
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