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Automatic film pasting and die cutting process

A film sticking and die-cutting technology, which is applied in metal processing and other directions, can solve problems such as burrs, irregular cutting edges, and increased waste material rate, and achieve the effects of reducing burrs, eliminating stress concentration, and reducing waste material rate

Active Publication Date: 2021-06-11
深圳亚士德科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Although the integrated film die-cutting process has been developed in the prior art, there are still some deficiencies in the prior art. For some films with relatively good thermoplasticity or special material films with good toughness, such as some thermoplastic resin films or graphene, carbon Films with good toughness such as nanotubes often have problems such as irregular cutting edges, burrs, and increased waste rate during cutting, and additional procedures such as manual rework and inspection are required

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] 1), paste the PET film layer on the metal material belt, the width control of the film layer is less than the width of the base material belt, so that the resistance wire heats the film layer and the base material evenly, and the heating temperature is lower than The melting temperature of the film layer material;

[0029] 2) Use a high-speed nozzle to spray the cooling liquid on the base material strip after the film is pasted, and the cooling liquid is evenly distributed on the PET film layer in the state of droplets with a size less than 5 μm; the cooling liquid is water-based cooling liquid, Contains 3.0%wt triethanolamine, 5.0%wt sodium hydroxide, 6.4wt% ethylene glycol butyl ether;

[0030] 3), carry out die-cutting operation to the substrate raw material tape after the cooling liquid treatment obtained in step 2) and after pasting the film, and cut the film tape into equal-spaced diaphragm units;

[0031] 4) Send the diaphragm unit obtained in step 3) to the sta...

Embodiment 2

[0033] 1), paste the PU adhesive film layer on the resin raw material tape, the width control of the adhesive film layer is less than the width of the substrate raw material tape, so that the resistance wire heats the adhesive film layer and the substrate raw material evenly, and the heating temperature is lower than The melting temperature of the film layer material;

[0034] 2) Use a high-speed nozzle to spray the cooling liquid on the base material belt after the film is pasted, and the cooling liquid is evenly distributed on the PU film layer in the state of droplets with a size less than 10 μm; the cooling liquid is water-based cooling liquid, Contains 6.3%wt triethanolamine, 6.0%wt sodium hydroxide, 4.3wt% ethylene glycol ether;

[0035] 3), carry out die-cutting operation to the substrate raw material tape after the cooling liquid treatment obtained in step 2) and after pasting the film, and cut the film tape into equal-spaced diaphragm units;

[0036] 4) Send the diap...

Embodiment 3

[0038] 1), paste the EVA adhesive film layer on the metal raw material belt, the width control of the adhesive film layer is less than the width of the base material material belt, so that the resistance wire heats the adhesive film layer and the base material material evenly, and the heating temperature is lower than The melting temperature of the film layer material;

[0039] 2) Use a high-speed nozzle to spray the cooling liquid on the base material belt after the film is pasted, and the cooling liquid is evenly distributed on the EVA film layer in the state of droplets with a size less than 4 μm; the cooling liquid is water-based cooling liquid, Contains 3.5%wt triethanolamine, 6.9%wt sodium hydroxide, 3.8wt% ethylene glycol butyl ether;

[0040] 3), carry out die-cutting operation to the substrate raw material tape after the cooling liquid treatment obtained in step 2) and after pasting the film, and cut the film tape into equal-spaced diaphragm units;

[0041] 4) Send t...

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Abstract

The invention relates to an automatic film pasting and die cutting process. Three existing procedures of film pasting machining, stamping forming machining and cutting for a finished product are directly integrated into three automatic integrated steps of film pasting, film cutting and stamping forming, so that a reworking procedure after original film covering machining for the finished product is omitted, and the machining cost is saved. Reasonable cooling treatment is carried out by spraying specific cooling liquid on the surface of a film before a die cutting procedure, the die cutting temperature of the film is reasonably reduced and controlled to be below a softening temperature or a vitrification temperature, meanwhile, stress concentration of a sheet layer can be eliminated, the progress of the die cutting procedure is benefited, burrs generated during cutting are reduced, and the waste material rate is reduced.

Description

technical field [0001] The invention relates to the field of film preparation, in particular to an automatic film sticking die-cutting process. Background technique [0002] At present, with the increase in the scale of demand for electronic consumer goods, the demand for screen film products for digital products including mobile phones, computers, and tablets is also increasing. The current film products of electronic products usually include an adhesive film and a substrate; the adhesive film is only set on certain areas on the substrate, and at the same time, due to the openings or irregular shapes in the products that need to be filmed, most of the die-cutting methods It needs to be mixed with manual work, and its process flow: 1. Lamination of base material and strip tape; 2. Stamping and forming; 3. Cutting release paper; 4. Manual transfer. [0003] CN105487341A relates to a production process of film, collectively referred to as substrate-free mobile phone film, spe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/38B26D7/08B26D7/27
CPCB26F1/38B26D7/08B26D7/27
Inventor 赵红辉蔡安生刘炳林
Owner 深圳亚士德科技有限公司