Printed circuit board manufacturing method based on 5G communication
A technology for printed circuit boards and manufacturing methods, which is applied in the directions of printed circuits, printed circuit manufacturing, and secondary processing of printed circuits, and can solve problems such as low lamination efficiency, high cost, and low substrate manufacturing efficiency
Active Publication Date: 2021-06-18
TEAN ELECTRONICS DA YA BAY CO LTD
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Problems solved by technology
[0006] The invention provides a method for manufacturing printed circuit boards based on 5G communication, which solves the problems of low manufacturing efficiency, high cost, poor dimensional stability, conflicts between reducing transmission loss and improving adhesive force, and low lamination efficiency in the existing substrates. question
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[0034] The embodiment of the present invention will be explained in detail below in conjunction with the accompanying drawings. The examples given are only for the purpose of illustration, and cannot be interpreted as limiting the present invention. The accompanying drawings are only for reference and description, and do not constitute the scope of patent protection of the present invention. limitations, since many changes may be made in the invention without departing from the spirit and scope of the invention.
[0035] A method for manufacturing a printed circuit board based on 5G communication provided by an embodiment of the present invention, such as figure 1 As shown, in this embodiment, it includes: inner layer circuit production, lamination process, drilling process, copper sinking electroplating process, outer layer circuit production, wet film process, surface process, post process;
[0036] In inner line making, see figure 2 , image 3 According to the preset typ...
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The invention relates to the technical field of circuit board manufacturing, and provides a printed circuit board manufacturing method based on 5G communication. The method comprises the steps: carrying out cutting and lithography processes according to a preset typesetting mode in the manufacturing of an inner-layer circuit so as to obtain inner-layer circuit boards; and in the laminating process, laminating a plurality of pre-laminated inner-layer circuit boards by adopting a pre-heating melting rule. According to the invention, the inner-layer circuit boards are arranged by adopting small-size pattern typesetting, so that the substrate material can be fully utilized; PCS of which every two are independent from each other is arranged, and each PCS is matched with more than eight micro-connection ends, so that higher supporting force is provided for the PCS, and the PCS can be effectively prevented from deforming; a honeycomb-shaped copper foil is laid between every two arrays, and the size of the inner-layer circuit boards is further solidified through internal acting force by utilizing the characteristics that the honeycomb-shaped copper foil contains many water caltrops and is not prone to deformation; and therefore, the size stability is guaranteed, the copper plating uniformity is improved, and the product yield is increased. The pre-melting rule is designed, and the plurality of pre-laminated inner-layer circuit boards are laminated, so that the yield is high, and the production cost is correspondingly reduced.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for producing a printed circuit board based on 5G communication. Background technique [0002] With the advent of the 5G era, and the development of high-performance / intelligence and networking of computers and information communication equipment, it is necessary to transmit and process large-capacity information at a higher speed. Therefore, the transmitted signal tends to be high-frequency gradually, and the high-frequency and high-speed requirements for signal processing and transmission of communication products are becoming more and more stringent. PCB companies have also put forward new requirements for the raw materials of 5G products, and a large number of low DK and high TG substrates such as PTFE / Rogers have been put into production. Although this type of substrate meets the requirements of 5G signal transmission, it still has the following di...
Claims
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IPC IPC(8): H05K3/06H05K3/36H05K3/46H05K3/38H05K3/28
CPCH05K3/06H05K3/36H05K3/4611H05K3/4626H05K3/389H05K3/282
Inventor 郑晓蓉王康兵
Owner TEAN ELECTRONICS DA YA BAY CO LTD