Resonant micro cantilever beam chip and preparation method thereof
A micro-cantilever beam and a cantilever beam technology are applied in the field of sensor chip preparation, which can solve the problems of reducing the quality detection sensitivity of the micro-cantilever arm and reducing the heat resistance effect of the micro-cantilever arm, and achieve the effects of reducing influence and heat conduction.
Pending Publication Date: 2021-06-25
上海迈振电子科技有限公司
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Problems solved by technology
[0005] 2. The micro-cantilever can improve the sensitivity of quality detection by reducing the size proportionally. Setting the heat-resistant hole structure on the micro-cantilever will reduce the heat-resistant effect of the proportionally reduced micro-cantilever. Therefore, it is necessary to increase the heat-resistant hole structure along the The length in the length direction of the micro-cantilever arm will reduce the effective size of the proportionally reduced micro-cantilever arm and reduce the quality detection sensitivity of the micro-cantilever arm
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[0051] In order to make the purpose, technical solution and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings. Apparently, the described embodiment is only one embodiment of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0052]The "embodiment" referred to herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present application. In the description of the embodiments of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown ...
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The embodiment of the invention discloses a resonant micro cantilever beam chip and a preparation method thereof. The resonant micro cantilever beam chip comprises a cantilever beam body, and the cantilever beam body comprises a first end part and a second end part which are connected, wherein the first end part is provided with a suspension film, the suspension film comprises a heating coil, the heating coil is used for heating the first end part to form a high-temperature area relative to the second end part, so that the second end part forms a low-temperature area relative to the first end part, and the lower surface of the suspension film and the upper surface of the first end part are provided with a heat insulation space. Based on the embodiment of the invention, the suspension film is arranged at the first end part, so that heat conduction between the heating coil and the cantilever beam body can be reduced, a high-temperature area relative to the second end part is formed at the first end part, a low-temperature area relative to the first end part is formed at the second end part, and a four-end piezoresistor is arranged at the second end part, so the influence of the temperature effect caused by the temperature gradient on the frequency detection of the micro-cantilever chip can be greatly reduced.
Description
technical field [0001] The invention relates to the field of sensor chip preparation, in particular to a resonant micro-cantilever chip and a preparation method thereof. Background technique [0002] In order to ensure that the integrated piezoresistive element on the resonant micro-cantilever with self-heating function can work normally, it is usually by setting a heat-resistant hole structure on the micro-cantilever arm so that the micro-cantilever is divided into two regions, and in one of them Zones are provided with heating coils to form a heated zone that is heated to form a high temperature zone relative to another zone that is unheated to form a low temperature zone relative to the heated zone. When the high-temperature area of the resonant micro-cantilever chip is heated to a certain temperature, the Wheatstone full bridge composed of four piezoresistors set in the low-temperature area has a temperature gradient, so there is a large temperature effect during the t...
Claims
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Login to View More IPC IPC(8): B81B3/00B81C1/00G01G3/13
CPCB81B3/0081B81C1/0015G01G3/13B81B2201/02
Inventor 于海涛
Owner 上海迈振电子科技有限公司