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Circuit board structure

A circuit board and backplane technology, which is applied in the structural connection of printed circuits, printed circuits, printed circuit components, etc., can solve the problems of inflexible configuration and production, and rigid design of circuit board products, so as to reduce hardware design costs and enhance general use. The effect of flexibility and flexible configuration

Pending Publication Date: 2021-06-25
GUANGZHOU KANGLONG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention proposes a circuit board structure to solve the technical problem that the existing circuit board products are rigid in design and cannot be flexibly configured for production. The invention can realize the flexible configuration of circuit board products and adapt to the ever-changing needs of customers for circuit board products. Helps reduce hardware design costs and realize the versatility of circuit board products

Method used

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Experimental program
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Effect test

Embodiment 1

[0101] See figure 1 , figure 1 A schematic diagram showing the circuit board structure of Embodiment 1 of the present invention. The details are as follows:

[0102] Board construction, including:

[0103] At least one base module 3 and at least one core control module 1 and at least one functional module 2 assembled on the base module 3, and any function module 2 and any core control module 1 are electrically connected to the base module 3; wherein, the base module 3. The core control module 1 and the functional module 2 are both of sheet laminate structure.

[0104] It should be noted that the backplane module 3, the core control module 1, and the functional module 2 are all chip laminate structures, which include but are not limited to single-layer boards (one-sided copper clad), double-layer boards (double-sided Copper clad) and multi-layer board structure are all within the scope of this application, and can be selected according to the hardware design requirements of...

Embodiment 2

[0111] Further improvements are made based on the versatile circuit board structure of Embodiment 1:

[0112] combine figure 1 with figure 2 As shown, the positional relationship between the core control module 1, the functional module 2 and the base module 3 can be vertical, or can form a certain inclination angle according to actual design requirements.

[0113]The number of functional modules 2 is generally configured in multiples to adapt to the ever-changing needs of customers. Among them, two adjacent functional modules 2 are parallel to each other, perpendicular to each other, or at a certain inclination angle, and the core The control module 1 and the functional module 2 are parallel to each other, can also be perpendicular to each other, and can also be at a certain angle of inclination. Those skilled in the art can determine the three types of modules according to the size of the base module 3 and the design requirements of the circuit board product. Flexible desi...

Embodiment 3

[0125] Compared with assembly processes such as pin headers and sockets, in the third embodiment, the circuit board of the core control module 1 is directly welded to the common base plate, eliminating the need for intermediate parts such as pin headers and sockets, thereby greatly reducing the cost of materials. In the third embodiment, the welding process is used to realize the assembly between the core control module 1 and the bottom plate module 3, as follows:

[0126] See Figure 3 to Figure 6 , image 3 shows a schematic plan view of a backplane module, Figure 4 show image 3 A schematic plan view of the interface area 301 of the central core control module, Figure 5 , 6 A schematic structural view of the core control module 1 is shown respectively. The core control module 1 has several core board tongue plates 101; the two sides of any core board tongue plate 101 are provided with mutually symmetrical core board front row type solder tabs 102 and core board rever...

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PUM

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Abstract

The invention discloses a circuit board structure, which comprises at least one bottom plate module, at least one core control module and at least one functional module, wherein the core control module and the functional module are assembled on the bottom plate module, and any functional module and any core control module are electrically connected with the bottom plate module; the bottom plate module, the core control module and the functional modules are all of a sheet type laminate structure, full modularization of a circuit board product is achieved, the core control module and the different functional modules can be assembled on the bottom plate module according to different circuit product requirements, the functional requirements of the circuit board product are met, the structure is suitable for various different product design requirements, flexible configuration of the circuit board product can be realized, the hardware design cost is reduced, and the universality of the circuit board product can be enhanced.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a fully modular circuit board structure suitable for different design requirements and flexible collocation. Background technique [0002] Circuit board, also known as printed circuit board, English abbreviation PCB (Printed circuit board), is an important electronic component, a support for electronic components, and a provider of circuit connections for electronic components. [0003] At present, there are many repetitive tasks in circuit board hardware design in the industry. Since the circuit board is integrated with a controller and a large number of supporting electronic components, once the product demand put forward by the customer changes, the entire circuit board needs to be re-improved. , Readjust the layout and wiring of the circuit board, resulting in an increase in hardware design costs. It can be seen that the current rigid circuit board product design canno...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K1/18
CPCH05K1/14H05K1/141H05K1/18H05K1/184
Inventor 康铁泷梁芝铭方晓志
Owner GUANGZHOU KANGLONG ELECTRONICS CO LTD
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