Real-time elimination method for melting near-surface layer forming defects of laser powder bed
A laser powder and laser remelting technology, which is applied in the field of additive manufacturing, can solve the problems of increasing forming time and cost, and cannot completely eliminate forming defects, and achieve the effects of timely elimination of pore defects, sufficient response time, and reduced surface roughness
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0053] This embodiment provides a laser powder bed melt proximal surface forming defect real-time elimination method, and the specific implementation steps are as follows:
[0054] Step 1: Monitor the distance H of the laser powder melt forming defect and the surface of the deposited layer by the external acquisition system.
[0055] Step 2: Determine the location of the defect in accordance with the distance h of the surface of the forming defect and the deposition layer, the specific steps are as follows:
[0056] 1) When the H> N deposition layer thickness, the laser remelling is immediately performed, and the reduction of deposited layer defects after the remelting is determined. If the defect eliminates the requirements, the release, the laser powder is melted; in turn, optimization The remelting process remelted again until the defect elimination meets the requirements;
[0057] 2) When the H ≤ N is deposited, the powder is performed, and the laser powder is melted;
[0058]...
Embodiment 2
[0067] This embodiment provides a laser powder bed melt proximal surface forming defect real-time elimination method, and the specific implementation steps are as follows:
[0068] Step 1: Monitor the distance H of the laser powder melt forming defect and the surface of the deposited layer by the external acquisition system.
[0069] Step 2: Determine the location of the defect in accordance with the distance h of the surface of the forming defect and the deposition layer, the specific steps are as follows:
[0070] 1) When the H> N deposition layer thickness, the laser remelling is immediately performed, and the reduction of deposited layer defects after the remelting is determined. If the defect eliminates the requirements, the release, the laser powder is melted; in turn, optimization The remelting process remelted again until the defect elimination meets the requirements;
[0071] 2) When the H ≤ N is deposited, the powder is performed, and the laser powder is melted;
[0072]...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Depth | aaaaa | aaaaa |
Particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information

- R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com