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Paste composition and method for manufacturing electronic component device

A technology of composition and compound, applied in the direction of conductive paint, coating, etc., can solve the problem of no improvement in solder reflow, and achieve the effects of excellent reliability, good reliability, good adhesion and good conductivity

Inactive Publication Date: 2021-06-29
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, in the method of the above-mentioned Patent Document 3, the solder reflow has not been improved

Method used

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  • Paste composition and method for manufacturing electronic component device
  • Paste composition and method for manufacturing electronic component device
  • Paste composition and method for manufacturing electronic component device

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0100] (Preparation of Paste Composition)

[0101] In the paste composition of the present embodiment, first, each of the above-mentioned components (A) to (D) and, if necessary, additives such as a coupling agent, a solvent, and the like are sufficiently mixed. Then, with respect to the paste composition of this embodiment, the mixed resin composition is subjected to a kneading treatment with a disperser, a kneader, a three-roll mill, or the like. Finally, the paste composition of this embodiment can be prepared by defoaming the kneaded resin composition.

[0102] (yield value of paste composition)

[0103] The yield value of the paste composition of this embodiment is 100 Pa or more and 200 Pa or less, and may be 120 Pa or more and 180 Pa or less. If the yield value is less than 100 Pa, the stability at the time of mounting will be poor, and the reliability of the electronic component obtained may fall. On the other hand, if the yield value exceeds 200 Pa, the leveling pr...

Embodiment 1～6、 comparative example 1～4

[0123] The components were mixed according to the compounding ratio described in Table 1, and kneaded with a roller to obtain a paste composition. The obtained paste composition was evaluated by the method mentioned later. The results are shown in Table 1 together. In addition, the material used in the Example and the comparative example used the material which has the following characteristics.

[0124] [(A) Thermosetting compound]

[0125] - (A1) thermosetting compound: epoxidized polybutadiene (manufactured by Nippon Soda Co., Ltd., brand name: JP-200, number average molecular weight 2200, epoxy equivalent 230 g / eq)

[0126] (A2) thermosetting compound: hydroxyethylacrylamide (manufactured by KJ Chemicals Corporation, brand name: HEAA (registered trademark))

[0127] [(B) Radical Initiator]

[0128] Dicumyl peroxide (manufactured by NOF Corporation, trade name: Percumyl (registered trademark) D; decomposition temperature in rapid heating test: 126°C)

[0129] [(C) Silv...

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Abstract

A paste composition contains (A) a thermosetting compound, (B) a radical initiator, (C) silver particles, and (D) silver powder, the total content of the component (C) and the component (D) being 85-95 mass% of the entire paste composition, the yield value being 100-200 Pa, the viscosity at a rotation speed of 2 rpm being 20-60 Pa.s, and the thixotropic ratio at 25 DEG C (viscosity at 2 rpm / viscosity at 20 rpm) is 3-6.

Description

technical field [0001] The present invention relates to a paste composition, and more specifically, to a paste composition applicable to narrowed bump spaces, and to a method of manufacturing an electronic component device using the paste composition. Background technique [0002] Conventionally, an area bump array package is known as a package having a two-dimensional bump arrangement as a substrate on which elements are mounted in an array (Patent Document 1). [0003] In recent years, the miniaturization of devices has progressed, and devices with a side size of 50 μm, 10 μm, etc., of 200 μm or less have also been proposed. These elements are typified by, for example, small-sized LEDs such as 50 μm and 10 μm, and micro LEDs, and are arranged in an array as RGB pixels on a display substrate for a display. [0004] For example, there is known a micro LED array display device in which a plurality of micro LED pixels are arranged on one micro LED panel (Patent Document 2). ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D4/02C09D4/06C09D5/24
CPCC09D4/06C09D5/24
Inventor 田纳优
Owner KYOCERA CORP