Phase-change film temperature control material

Abstract

The invention discloses a phase-change film temperature control material. The material is of a three-layer structure, the middle layer is a phase-change microcapsule film, and the upper layer and the lower layer are high-thermal-conductivity graphite films. The phase-change film temperature control material provided by the invention can strengthen the heat transfer capability of the phase-change film through the high heat-conducting property, and is matched with phase-change microcapsules to obtain excellent heat management performance. A phase-change film has good thermal conductivity and thermal stability, is stable in form, and has good flexibility at the same time. The material can be used in micro electronic equipment, an ideal heat management effect is achieved, and the service life of an electronic component is effectively prolonged.

Description

technical field [0001] The invention relates to the technical field of phase change materials, and more specifically, to a phase change thin film temperature control material and its preparation method and application. Background technique [0002] With the rapid development of 5G information technology, electronic devices tend to be miniaturized and high-power. While the volume of electronic products is continuously shrinking, the operating frequency of electronic devices is increasing sharply, which will generate a lot of heat during work. The problem of local heat concentration and instantaneous heat surge has become a major problem to be solved in the development of electronic technology. At the same time, due to the strict limitation of the internal space, traditional cooling methods such as cooling pipes or fans are difficult to use. In order to solve the above problems, phase change materials are gradually applied to the heat dissipation of electronic equipment. [...

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the defect that the temperature rise of electronic components cannot be effectively alleviated in the high power density and compact space environment described in the above prior art, the present invention provides a phase change material film, and the temperature control material of the phase change film can meet the requirements of micro Requirements for passive cooling of small and high-power electronic components

Images