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A kind of etching solution for microscopic analysis of copper foil and its preparation method and etching method

A technology of microscopic analysis and preparation methods, applied in the preparation of test samples, etc., can solve problems such as complex sample processing

Active Publication Date: 2022-07-15
JIUJIANG TELFORD ELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The basis for improving the performance of copper foil is the microscopic analysis of the product. However, the development of domestic copper foil microscopic analysis is currently limited. (SEM), Electron Backscatter Diffraction (EBSD), Scanning Probe Technology (SPM), etc. However, the processing of samples by these analysis methods is very complicated

Method used

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  • A kind of etching solution for microscopic analysis of copper foil and its preparation method and etching method
  • A kind of etching solution for microscopic analysis of copper foil and its preparation method and etching method

Examples

Experimental program
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Embodiment 1

[0025] According to the etching solution for microscopic analysis of copper foil according to the embodiment of the present invention, the preparation method includes the following steps:

[0026] S1 Preparation of saturated cupric ammonium chloride ((NH 4 ) 2 CuCl 4 ) ·H 2 O solution, add (NH) to 100 mL of water 4 ) 2 CuCl 4 The crystalline solid (purity is 98%), the temperature of the aqueous solution in the beaker is controlled at 35 ° C, and (NH) is added while stirring. 4 ) 2 CuCl 4 Solid until the solid is no longer dissolved to obtain saturated cupric ammonium chloride solution;

[0027] S2 Preparation of saturated FeCl 3 solution, add 5 mL of dilute hydrochloric acid to 100 mL of water, and continue to stir while adding FeCl 3 Solid, the temperature of the aqueous solution in the beaker is controlled at 25 ° C, until the solid is no longer dissolved, to obtain a saturated ferric chloride solution;

[0028] S3 Prepare etching solution, use a graduated cylinde...

Embodiment 2

[0034] Hereinafter, the etching method described in Example 1 is used to etch any copper foil in the market, and the etching effect thereof will now be described in further detail.

[0035] The metallographic microscope shooting effect of copper foil before and after etching by etching solution is as follows figure 1 As shown in the figure, the copper surface before etching is rough, without obvious graininess, and the outline of copper particles cannot be visually seen, which is not conducive to microscopic crystal analysis. After etching, the grain outline of the copper surface is obvious, and the copper particles can be clearly distinguished, which is conducive to the analysis of microscopic crystals.

[0036] The SEM and EBSD shooting effects of the copper foil before and after etching by the etching solution are as follows figure 2 As shown, the copper surface is flat before etching, the grains cannot be distinguished, and the microscopic grain size and lattice orient...

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Abstract

The invention discloses an etching solution for microscopic analysis of copper foil and a preparation method and etching method thereof. The preparation method of the etching solution comprises the following steps: preparing a saturated cupric ammonium chloride solution and a saturated ferric chloride solution; The cupric ammonium solution, saturated ferric chloride solution and HCl were poured into a volumetric flask and mixed, and then deionized water was added to the volume to obtain an etching solution. After etching the surface of the copper foil with the etching solution for the microscopic analysis of the copper foil prepared by three simple chemical reagents, the crystal outline of the copper can be clearly displayed, and the crystals on the surface of the copper foil can be visually observed under the metallographic microscope. The grain size, lattice orientation, grain boundary, etc. can be analyzed under SEM, which lays the foundation for the microscopic analysis of copper foil materials.

Description

technical field [0001] The invention relates to the technical field of microscopic analysis of copper foil materials, in particular to an etching solution for microscopic analysis of copper foils, a preparation method and an etching method thereof. Background technique [0002] In recent years, with the development of the lithium battery automobile industry and various consumer electronic devices, the supply of copper foil materials, which are used as negative electrode current collectors of lithium batteries and signal transmission of electronic devices, has been in short supply. To this end, many companies have begun to join the copper foil production team, making the domestic copper foil output higher and higher. [0003] With the development of the copper foil industry, domestic and foreign electrolytic copper foils have been fully integrated, which requires that my country's electrolytic copper foil industry must be considered from a global perspective, and must also ha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N1/32C23F1/18
CPCC23F1/18
Inventor 李红琴江泱范远朋
Owner JIUJIANG TELFORD ELECTRONICS MATERIAL CO LTD