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Mini-LED chip capable of realizing uniform light distribution and preparation method thereof

A mini-led, light uniform technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of affecting charge injection and extraction, potential difference of transparent conductive layer, inconsistent discoloration efficiency of LED chips, etc., to improve light extraction efficiency, avoid Severely absorbing effect

Active Publication Date: 2021-07-16
XIAMEN CHANGELIGHT CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to provide a mini-LED chip capable of uniform light distribution and its preparation method, to solve the problem that the potential difference between the center and the edge of the transparent conductive layer affects the injection and extraction of charges, resulting in the unevenness of each area of ​​the LED chip. The problem of inconsistent color changing efficiency

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  • Mini-LED chip capable of realizing uniform light distribution and preparation method thereof
  • Mini-LED chip capable of realizing uniform light distribution and preparation method thereof
  • Mini-LED chip capable of realizing uniform light distribution and preparation method thereof

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Embodiment Construction

[0046] In order to make the content of the present invention clearer, the content of the present invention will be further described below in conjunction with the accompanying drawings. The invention is not limited to this specific example. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0047] Such as figure 1 , figure 2 and image 3 As shown, a mini-LED chip that can achieve uniform light distribution, including:

[0048] substrate1;

[0049] An epitaxial stack 4, an undoped layer 5, and a second-type semiconductor thin layer 6 are sequentially stacked on the surface of the substrate 1. The epitaxial stack 4 includes a first-type semiconductor layer 4.1 and an active region 4.2 stacked in sequence along the first direction. and the second type semiconductor layer 4.4; etch along the surface of the second ty...

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Abstract

The invention provides a mini-LED chip capable of realizing uniform light distribution and a preparation method thereof. The preparation method comprises the steps that: an epitaxial lamination layer, a non-doped layer and a second type semiconductor thin layer are stacked on the surface of a substrate in sequence; and meanwhile, a transparent conducting layer is arranged on the surface of the second type semiconductor thin layer, the transparent conducting layer is in contact with the second type semiconductor thin layer in a groove embedding mode, and the insulating layer is attached to the side wall of a through hole and extends to part of the surface of the transparent conducting layer. Therefore, after a current is injected from electrodes, the current is uniformly expanded to the second type semiconductor thin layer through the groove, the potential difference between the center and the edge of the transparent conductive layer is reduced, the current can be uniformly distributed, and the phenomenon of current crowding of the mini-LED is avoided.

Description

technical field [0001] The invention relates to the field of light-emitting diodes, in particular to a mini-LED chip capable of realizing uniform light distribution and a preparation method thereof. Background technique [0002] A light-emitting diode (English: Light Emitting Diode, referred to as: LED) is a semiconductor electronic component that can emit light. LED has the advantages of high efficiency, long life, small size, low power consumption, etc., and can be used in indoor and outdoor white light lighting, screen display, backlight and other fields. In particular, the rapid development of display technology makes the market demand for Mini-LED chips develop rapidly, and also promotes the technological development of Mini-LED. Most Mini-LEDs use a transparent substrate + flip-chip soldering structure. If it is directly applied to a display screen, the requirements for the uniformity of light emission of the entire chip will be significantly improved, so that the cur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/38H01L33/42H01L33/00
CPCH01L33/382H01L33/42H01L33/005
Inventor 林志伟陈凯轩蔡建九曲晓东赵斌
Owner XIAMEN CHANGELIGHT CO LTD