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Optical transceiver assembly and related product

A technology for optical transceiver components and light emitting devices, applied in optical components, optics, light guides, etc., can solve the problems of multi-packaging materials, process cost, material cost consumption, etc., so as to reduce production costs, save material costs and process costs. Effect

Active Publication Date: 2021-07-20
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The manufacturing method of this BOSA needs to perform multiple packaging operations, and needs to use more packaging materials, which consumes a lot of process costs and material costs.

Method used

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  • Optical transceiver assembly and related product
  • Optical transceiver assembly and related product
  • Optical transceiver assembly and related product

Examples

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Embodiment Construction

[0041] As mentioned above, the traditional way to produce BOSA needs to package the light emitting device and the light receiving device into coaxial modules separately, and then package the coaxial modules together. Since multiple packaging operations need to be performed during production, more packaging materials need to be used, so the consumption of material costs and process costs is relatively large. The high production cost is not conducive to the promotion and application of BOSA in the field of optical communication.

[0042] Based on the above problems, an optical transceiver component, an optical transceiver method, and related products are provided in embodiments of the present application. The optical transceiver components adopt integrated devices, which eliminates the strict requirements of the spatial optical path on the coaxial packaging of the components, thereby simplifying the packaging and saving production costs. In practical applications, optical transce...

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Abstract

The invention discloses an optical transceiver assembly and a related product. The optical transceiver assembly comprises an optical transmitting device, a polarization beam splitting rotator, an optical receiving device, an optical fiber, a multiplexer / demultiplexer and a wavelength processor, wherein the light transmitting device is optically connected with a first port of the multiplexer / demultiplexer; a first optical interface and a second optical interface of the optical receiving device are respectively and optically connected with a second port of the multiplexer / demultiplexer and a first port of the wavelength processor; and a third port of the multiplexer / demultiplexer, the wavelength processor and the optical fiber are respectively and optically connected with the polarization beam splitting rotator. The optical transceiver assembly realizes two-way transmission of optical waves. According to the optical transceiver assembly provided by the invention, the polarization beam splitting rotator and other integrated devices are adopted, so that light waves are transmitted through the chip integrated devices no matter whether light is received or emitted. Therefore, compared with a BOSA which transmits light waves by means of a spatial light path, the optical transceiver assembly disclosed by the invention saves the material cost and the process cost required by packaging, thereby reducing the production cost.

Description

technical field [0001] The present application relates to the technical field of optical devices, in particular to an optical transceiver component and related products. Background technique [0002] Bi-Directional Optical Sub-Assembly (BOSA, Bi-Directional Optical Sub-Assembly) is a commonly used component in the field of optical communication, which has the functions of light emission and light reception. In the current production process, the light emitting device and the light receiving device need to be separately packaged into a coaxial module, and then the two coaxial modules and the spatial filter are assembled together to obtain BOSA. [0003] figure 1 It is a schematic diagram of the package structure of BOSA. exist figure 1 Among them, the spatial filter 101 is arranged between the coaxial module 102 packaged with the light emitting device and the optical lens 103; one side of the optical lens 103 is the spatial filter 101, and the other side is the optical fib...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
CPCG02B6/4246G02B6/4213G02B6/4215G02B6/4245G02B6/424
Inventor 锁靖宋小鹿李彦波
Owner HUAWEI TECH CO LTD