Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Pressure sensor packaging module

A technology of pressure sensor and molding, which is applied in the direction of piezoelectric/electrostrictive/magnetostrictive devices, instruments, measuring force, etc., can solve the problems of pressure sensor packaging process complexity, poor chip protection effect, high cost, etc., and achieve improvement Protective effect, simplify the manufacturing process, reduce the effect of dosage

Pending Publication Date: 2021-07-23
SUZHOU NOVOSENSE MICROELECTRONICS CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a pressure sensor packaging module to solve the problems in the prior art that the pressure sensor packaging process is complicated, the cost is high, and the protection effect on the chip is poor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Pressure sensor packaging module
  • Pressure sensor packaging module
  • Pressure sensor packaging module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0058] As a preferred embodiment, the pressure sensor package module further includes a frontal potting layer 310; the front surface debris layer is disposed in the protective chamber, covering the front side of the MEMS pressure sensing chip 300, The front side of the MEMS pressure sensing chip 300 is directly in contact with the external fluid atmosphere, further improving the protection effect.

[0059] Further, the inner wall of the protective frame 500 includes a swimming groove, and when the front pin sealing layer 310 is provided, the liquid potting glue is larger due to the large surface tension, along the side of the protective frame 500. The wall is climbed up, which in turn affects the potting effect. The glue climbed may also destroy other structures on the PCB substrate 100, and the anti-climbing groove can effectively block the glue from climbing, protect other original devices, and improve the final finished product. Rate. The anti-climbing groove can be an equal hi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a pressure sensor packaging module, and the packaging module comprises a PCB substrate, an ASIC chip, an MEMS pressure sensing chip and an MEMS base; the ASIC chip is fixedly connected to the PCB substrate, and the ASIC chip is fixedly connected to the PCB substrate. A preset through hole matched with the MEMS base is formed in the PCB substrate, and the MEMS base penetrates through the preset through hole to penetrate through the PCB substrate; the MEMS pressure sensing chip is arranged on the MEMS base, and the MEMS pressure sensing chip and the ASIC are arranged on the same side of the PCB substrate; the MEMS base comprises a contact through hole, and a fluid to be measured applies pressure to the MEMS pressure sensing chip through the contact through hole; and the MEMS base is a corrosion-resistant base. The manufacturing process of the packaging piece is simplified, the production efficiency is improved, the use amount of corrosion-resistant materials is reduced, the cost is further saved, and the protection effect on the MEMS pressure sensing chip is improved.

Description

Technical field [0001] The present invention relates to the field of chip packages, and more particularly to a pressure sensor package module. Background technique [0002] With the development of intelligent machinery and the advancement of science and technology, the sensor is an important device that is autonomous as a machine, and its development is increasingly received by all walks of life. [0003] Specific to the pressure sensor, the existing pressure sensor package structure, is generally wiring gold plated on the corrosion-resistant ceramic substrate to obtain a ceramic substrate, and then secure the pressure sensing chip on the ceramic substrate to obtain the pre-package, and then the package The material is connected to the PCB plate through the reflow soldering from the PCB plate, and finally, in the ceramic substrate, the pressure sensing chip is in contact with the fluid to be tested. However, there are many problems in the prior art. For example, the packaging pro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81B7/02G01L1/00
CPCB81B7/02B81B7/0032B81B7/0058G01L1/005B81B2201/0264
Inventor 于成奇陈利宏王悦锋
Owner SUZHOU NOVOSENSE MICROELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com