Liquid storage and controlled release assembly and microfluidic detection chip
A liquid storage and detection chip technology, used in semiconductor/solid-state device parts, optical components, engine components, etc., can solve the problems of inability to release multiple reagents separately, single sample processing, and instability.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0034] Figure 10 It is a cross-sectional view when the liquid storage and controlled release assembly is installed in the "liquid storage and controlled release assembly installation chamber". At this time, the metal ring and the heat-conducting metal block in the metal ring paraffin valve are not integral structures. The substrate structure under the metal ring paraffin valve is a porous structure, and a heating device is connected to the structure for heating and melting the paraffin. The reagents are pre-packaged in the bottle structure, and the middle of the metal ring is sealed with paraffin. Below the metal ring is a plane heating device. The metal ring is closely connected with the mouth of the liquid flow pipeline of the substrate. After heating by the heating device, the solid paraffin melts, and the reagent is separated from the bottle structure by centrifugal force, and enters the liquid flow pipeline through the metal ring paraffin valve.
[0035] Figure 11 It...
Embodiment 2
[0037] Figure 12It is a sectional view when the liquid storage and controlled release component is installed in the "liquid storage and controlled release component installation cavity" (the metal ring and the heat-conducting metal block are not set as an integral structure, and the circuit board is set below), at this time the metal ring is paraffin The metal ring in the valve is not integrated with the heat-conducting metal block. The substrate structure under the metal ring paraffin valve is a porous structure, and a heating device is connected to the structure for heating and melting the paraffin. The heating device is connected to the lower circuit board, and the heating device is controlled to start through the circuit system. The passive board is essentially a circuit board, and through reasonable wiring, heating devices are welded at the hole-like or hole-like structures below the installation cavities of the substrate liquid storage and controlled release components....
Embodiment 3
[0039] Figure 14 It is a cross-sectional view of the metal ring paraffin valve after the overall package (the metal ring and the heat conduction metal block are set as an integrated structure). At this time, the metal ring and the heat conduction metal block in the metal ring paraffin valve are set as an integral structure. At this time, the heat-conducting raised part of the metal ring can be stuck at the lower structure to play a role of positioning and fixing. And the raised part of the metal ring is close to the lower structure. The substrate structure under the metal ring paraffin valve is a hole-like or hole-like structure, and a heating device is connected to the structure for heating and melting the paraffin. The heating unit is connected to the passive plate below. The heating device is set as a heating resistor. In order to further improve the heating effect, a heat-conducting metal sheet is added above the heating resistor. The heat-conducting metal sheet and th...
PUM
Property | Measurement | Unit |
---|---|---|
Thermal conductivity | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com