Unlock instant, AI-driven research and patent intelligence for your innovation.

Insert-molded electronic modules using thermally conductive polycarbonate and molded interlocking features

An electronic module and polycarbonate technology, applied in the direction of thermoplastic polymer dielectric, dielectric properties, electrical components, etc., can solve the problems of low heat conduction, heat conduction bottleneck from circuit board to heat sink, etc.

Pending Publication Date: 2021-07-23
COVESTRO LLC
View PDF82 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Typically, the heat transfer from this material is low, and as a result, there is a bottleneck in the transfer of heat from the board to the heat sink

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Insert-molded electronic modules using thermally conductive polycarbonate and molded interlocking features
  • Insert-molded electronic modules using thermally conductive polycarbonate and molded interlocking features
  • Insert-molded electronic modules using thermally conductive polycarbonate and molded interlocking features

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The invention will now be described for purposes of illustration and not limitation. Unless in operative examples or otherwise indicated, all numbers expressing amounts, percentages, etc. in the specification are to be understood as being modified in all instances by the word "about".

[0022] "Interlock" as used in the context of this specification means that material at least partially or possibly completely enters a channel, hole, port, bore or crevice of a component of an assembly. In the case of printed circuit boards, for example, the material could be a heat spreader material that can be accessed through screw holes, through holes and / or vertical interconnect access (VIA) holes to attach electrical / electronic components, Preferably a printed circuit board, interlocked with the heat sink. Exemplary printed circuit boards include metal core printed circuit boards as well as printed circuit boards formed from laminates and dielectric materials such as polytetrafluo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

An insert molded electronic module is disclosed that includes an electrical component / electronic component and a heat sink that interlocks with the electrical component / electronic component, and optionally also encapsulates the electrical component / electronic component to provide thermal management to the component. The heat spreader is formed by using a thermally conductive thermoplastic polymer composition and replaces potting compounds and thermal interface materials typically used in such assemblies. The electrical / electronic component includes an opening that allows the thermally conductive thermoplastic polymer composition to flow therethrough and interlock with the electrical / electronic component. The electronic module may include an insert between the electrical / electronic component and the heat sink, wherein the insert includes an aperture that allows the thermally conductive thermoplastic polymer composition to flow therethrough and interlock with the insert.

Description

technical field [0001] The present invention relates generally to electronic devices and heat sinks, and more particularly to an insert molded electronic module having electrical / electronic components integrated with the heat sink with molded interlock features. Background technique [0002] Cutting-edge light-emitting diode (LED) light bulbs and other electronic devices contain printed circuit boards and various electronic components that must be electrically isolated from user contact. These devices must also have adequate thermal management to keep operating temperatures below critical values ​​for extended lifetime; current high-power LEDs generate significant heat output when up to 60% of the electrical power input is converted to heat. [0003] While there are many different designs for thermal management in these types of electronic devices, the primary path for heat dissipation from such electronic devices is usually through the base (to which the electronics are mou...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28H05K1/02H05K3/00
CPCH05K1/0209H05K3/0064H05K3/284H05K2201/0129H05K2201/09063H05K2201/10106H05K2201/2072H05K2203/1327H05K1/021
Inventor J·M·罗伦佐J·麦肯纳
Owner COVESTRO LLC