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Gap-removing and bubble-removing type mutual inductor glue sealing process

A transformer and plastic sealing technology, applied in the field of transformers, can solve the problems of short service life of transformers, serious discharge phenomenon of transformers, and potential safety hazards, and achieve the effects of avoiding discharge phenomena, not easy to loosen, and improving safety.

Inactive Publication Date: 2021-07-30
杨浩
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The windings of the existing transformers are generally potted with epoxy resin and the shell, but the surface of the epoxy resin is prone to cracks, and at the same time, the contact surface between the epoxy resin and the windings is easily loosened or larger cracks are generated due to tiny gaps and air bubbles , leading to serious discharge of the transformer, there is a potential safety hazard, and it also leads to a short service life of the transformer

Method used

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  • Gap-removing and bubble-removing type mutual inductor glue sealing process
  • Gap-removing and bubble-removing type mutual inductor glue sealing process
  • Gap-removing and bubble-removing type mutual inductor glue sealing process

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Embodiment 1

[0046] see Figure 1-2 , in the figure, a represents the bottom plate, and b represents the part where the winding is in contact with the bottom plate. A seam-removing and bubble-removing type transformer glue sealing process includes the following steps:

[0047] S1. First make the epoxy resin heat shrinkable board 1, and then evenly lay the epoxy resin heat shrinkable board 1 on the bottom plate of the transformer around the winding and the shell;

[0048] S2. Then pour molten epoxy resin onto the top of the epoxy resin heat-shrinkable plate 1, and heat the bottom plate at the same time, and the heating will soften or melt the bottom of the epoxy resin heat-shrinkable plate 1, so that the degree of bonding between the epoxy resin heat-shrinkable plate 1 and the bottom plate is improved. Well, let the bottom of the epoxy resin heat shrinkable board 1 be heated and softened, and the high-permeability glue inside overflows and infiltrates between the epoxy resin heat shrinkable...

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Abstract

The invention discloses a gap-removing and bubble-removing type mutual inductor glue sealing process, and belongs to the field of mutual inductors. According to the gap-removing and bubble-removing type mutual inductor glue sealing process, an epoxy resin thermal shrinkage plate is laid on a bottom plate before an outer epoxy resin layer is poured, and the bottom plate is heated before pouring, so that on one hand, the lower end part of each inner shrinkage bubble ball is heated to be softened or melted, binding force between the epoxy resin thermal shrinkage plate and the bottom plate is improved, meanwhile, high-permeability glue in the epoxy resin thermal shrinkage plate overflows downwards and permeates into a micro gap between the epoxy resin thermal shrinkage plate and the bottom plate so as to eliminate the micro gap between the epoxy resin thermal shrinkage plate and the bottom plate, and thus the stability of the mutual inductor after glue sealing is effectively guaranteed, the mutual inductor is not prone to loosening, the discharge phenomenon is effectively avoided, and safety is improved; and on the other hand, the inner shrinkage bubble balls expand during heating, and the upper end parts of the inner shrinkage bubble balls shrink during cooling treatment after pouring, so that the interior of molten epoxy resin loses support and collapses, an internal gap is effectively filled, bubbles are effectively eliminated, and the stability is remarkably improved.

Description

technical field [0001] The invention relates to the field of transformers, in particular to a seam-removing and bubble-removing glue-sealing process for transformers. Background technique [0002] Transformer, also known as instrument transformer, is a general term for current transformer and voltage transformer. It can change high voltage into low voltage and high current into small current for measurement or protection system. Its function is mainly to convert high voltage or high current into standard low voltage (100V) or standard small current (5A or 1A, both refer to rated value) in proportion, so as to realize the standardization and miniaturization of measuring instruments, protection equipment and automatic control equipment. change. At the same time, the transformer can also be used to isolate the high-voltage system to ensure the safety of people and equipment. [0003] In order to transmit electric energy, the power system often uses AC voltage and high curren...

Claims

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Application Information

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IPC IPC(8): B29C39/02B29C39/22B29C39/38H01F41/00
CPCB29C39/38B29C39/02B29C39/22H01F41/005
Inventor 杨浩
Owner 杨浩
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