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Optoelectronic module with an optical emitter and an optical receiver

A technology for optical receivers and transmitting tubes, applied in circuits, electrical components, electrical solid devices, etc., can solve problems such as precious space, achieve the effects of reducing surface leakage, improving yield rate, and simplifying the manufacturing process

Pending Publication Date: 2021-07-30
AMS SENSORS SINGAPORE PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In some cases, space is at a premium in the host device

Method used

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  • Optoelectronic module with an optical emitter and an optical receiver
  • Optoelectronic module with an optical emitter and an optical receiver
  • Optoelectronic module with an optical emitter and an optical receiver

Examples

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Embodiment Construction

[0020] This disclosure describes optoelectronic modules operable to emit light of a particular wavelength (eg, in the infrared (IR) portion of the spectrum) and to detect light of the same wavelength, for example. The invention also describes a wafer-level process for the simultaneous parallel fabrication of multiple modules.

[0021] like figure 1 As shown in , an optoelectronic module 20 includes a light source (sometimes referred to as a light emitter) 22 and a light receiver 24 mounted on a support such as a printed circuit board (PCB) substrate 26 . Light source 22 may, for example, be implemented as a VCSEL or LED die (ie, a semiconductor chip). Likewise, light receiver 24 may, for example, be implemented in an integrated circuit die (ie, a semiconductor chip) that includes a photodiode to detect light and associated processing circuitry.

[0022] Electrical contacts on the bottom of each die 22 , 24 may be electrically coupled to a PCB substrate 26 through respective ...

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Abstract

An apparatus includes an optoelectronic module including a light emitting die and a light receiver die mounted on a PCB substrate. The optoelectronic module further includes an optical element on the light emitting die and an optical element on the light receiver die, the optical elements being composed of a first epoxy. A second epoxy laterally surrounds and is in contact with respective side surfaces of the light emitting die, the light receiver die and the optical elements, wherein the second epoxy provides an optical barrier between the light emitting die and the light receiver die. A method of manufacturing such modules is described as well.

Description

technical field [0001] The invention relates to an optoelectronic module comprising an optical transmitter and an optical receiver. Background technique [0002] Various consumer electronics and other host devices include compact optoelectronic modules with integrated light sensing devices or light emitting devices. In some cases, space is at a premium in the host device. Therefore, it is desirable to keep the modules as small and compact as possible. Further, for modules that include both light emitting and light detecting components, it may be important to provide optical isolation between these components. Contents of the invention [0003] The present disclosure describes optoelectronic modules including optical transmitters and optical receivers and methods of making these modules. [0004] In one aspect, for example, this disclosure describes a method comprising replicating optical elements onto respective surfaces of a plurality of light-emitting dies operable to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L31/173H01L33/56H01L33/58
CPCH01L25/167H01L33/56H01L2933/005H01L33/58H01L31/173H01L33/44H01L2933/0025H01L2933/0058
Inventor 王吉余启川梁金华哈特姆特.鲁德曼
Owner AMS SENSORS SINGAPORE PTE LTD