Low-dielectric-constant polyhedral oligomeric silsesquioxane/epoxy resin nano composite material and preparation method thereof
A technology of polysilsesquioxane and nanocomposite materials, which is applied in the field of integrated circuits, can solve the problems of not reaching low dielectric constant materials, etc., and achieve the effects of excellent reactivity, lower dielectric constant, and fast curing speed
Active Publication Date: 2021-08-03
SHANG HAI YINAI NEW MATERIAL TECH LTD
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Problems solved by technology
At present, epoxy resin has the characteristics of excellent adhesion and insulation and is widely used in the electrical and electronic industry; however, the dielectric constant of epoxy resin materials currently used in the electrical and electronic industry is around 4, which is not up to 5G communication electronics. The requirements for low dielectric constant materials used in equipment, so it is particularly important to urgently develop low dielectric constant materials that can be used in 5G communication electronic equipment
Method used
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Embodiment
[0034] Example An epoxy resin nanocomposite of a low dielectric constant was prepared from the following method:
[0035] (1), prepare materials:
[0036] The bisphenol A epoxy resin E51103G is specifically a South sub-epoxy 128 resin;
[0037] Nanoparticles 50g; nanoparticles are methacryloxypropyl cage (POS, POSS, POLYHEDRAL OLIGOMERIC SILSESQUIOXANES);
[0038] 48g of the open loop, the open loop agent is methacrylic acid;
[0039] Catalyst 0.44 g, catalyst is triphenylphosphine;
[0040] Diluent 28g, diluent is a hydroxyethyl methacrylate;
[0041] Photo initiator, photoinitiator is 2,4,6-trimethylbenzoyl-diphenyl oxide.
[0042] (2), epoxy resin modification
[0043] 103 g of bisphenol A epoxy resin was added to the three flasks, warmed to 80 ° C, stirred at 150 r / min, and 48 g of methacrylic acid was added thereto, and then the temperature was 10 ° C, and then added to it four times. Trobhenylphosphine catalyst, each time plus 0.1 g, 0.1 g, 0.12 g, 0.12g, and each time it ...
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The invention relates to the technical field of integrated circuits, in particular to a low-dielectric-constant polyhedral oligomeric silsesquioxane / epoxy resin nano composite material and a preparation method thereof. The low-dielectric-constant polyhedral oligomeric silsesquioxane / epoxy resin nano composite material is prepared from modified epoxy resin, polyhedral oligomeric silsesquioxane and a photoinitiator, the modified epoxy resin is put into use after ring opening modification, double bonds are introduced to an epoxy resin chain, the double bonds are high in activity, free polymerization can occur, the curing speed is high, the curing temperature is low, and curing forming can be conducted at the room temperature in a light curing mode; therefore, the polyhedral oligomeric silsesquioxane / epoxy resin nano composite material prepared by the method is more suitable for being used as a bonding and packaging material of a chip and a circuit board.
Description
Technical field [0001] The invention relates to the technical field of integrated circuits, specifically to packaging materials and insulating materials used in electronic devices, and more specifically to a low dielectric constant cage polysilsesquioxane / epoxy resin nanocomposite material and its preparation method. [0002] technical background [0003] 5G communication technology makes our production and life more efficient and faster. In recent years, we can deeply feel the impact of electronic products on our lives, which has greatly improved people's quality of life. As an important part of electronic components, electronic packaging materials can effectively protect electronic components from interference from the external environment and ensure effective signal transmission and functional stability. The advent of a new generation of electronic products has put forward higher requirements for the performance of electronic packaging materials. Under this trend, traditio...
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IPC IPC(8): C08F290/06C08F230/08
CPCC08F290/064C08F230/085
Inventor 陈玉伟胡振东王泉槐凯崔欣魏怀笑吴韦菲张白浪胡金金车俊伯张田砚张建明
Owner SHANG HAI YINAI NEW MATERIAL TECH LTD