Wafer processing device, wafer conveying assembly and working method thereof

A technology for conveying components and processing devices, applied in the direction of conveyor objects, cleaning methods and tools, chemical instruments and methods, etc., which can solve problems such as wafer surface contamination, processing and processing process impact, wafer quality deterioration, etc.
CN113206032AInactive Publication Date: 2021-08-03CHANGXIN MEMORY TECH INC
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
CHANGXIN MEMORY TECH INC
Publication Date
2021-08-03
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention relates to a wafer processing device, a wafer conveying assembly and a working method thereof. The wafer conveying assembly comprises a moving mechanism and a purging structure. The moving mechanism comprises a tray. The tray can drive the wafer to move into the process chamber or move out of the process chamber. The purging mechanism is provided with a purging surface, and the purging area of the purging surface can completely cover the wafer placed on the tray. And when the tray of the moving mechanism drives the wafer to be positioned outside the process chamber, the purging mechanism is arranged right above the tray at an interval, so that the purging surface and the wafer on the tray are arranged in a face-to-face manner. In the process that the protective gas directly faces the wafer and purges the whole outer surface of the wafer, the pollution phenomenon that oxidation or particulate matter adheres to the surface of the wafer can be well avoided, it can be avoided that when the moving mechanism carries the wafer to move into the process cavity, water vapor is brought into the process cavity synchronously, and the surface cleanliness of the wafer can be guaranteed; and the surface of the wafer can be prevented from being oxidized, and the product quality is improved.
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Description

technical field

[0001] The invention relates to the technical field of semiconductor processing, in particular to a wafer processing device, a wafer transfer assembly and a working method thereof. Background technique

[0002] In the wafer production process, a robot arm is usually used to move the wafer, so as to transfer the wafer from one position to another in space. For example, transferring wafers from a load chamber that stores wafers into a process chamber to process the wafers such as etching, or transferring wafers from one type of process chamber to another Types of process chambers to achieve different types of processing on wafers.

[0003] However, the following cleanliness problems will exist in the process of transferring wafers by traditional robotic arms: for example, when the wafers are moved out of the process chamber, because some reactive gases (such as sulfur dioxide and fluorine gas) are still attached to the surface of the wafers, the The reaction ...

Claims

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