Semiconductor chip and its mfg. method
A semiconductor and conductor technology, applied in the field of buffer layer formation, can solve problems such as dielectric layer and component performance changes, lithographic image deformation, low wafer productivity, etc.
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[0038]The present invention describes a method for forming a buffer layer in a liner layer and separating it into a liner stop layer and a dielectric layer. If necessary, the pad stop layer can be polished, etched and processed. When the liner stop layer is no longer needed, it can be selectively removed by etching to expose the buffer layer. The buffer layer can now be processed and / or selectively etched away to expose the dielectric layer. Since the dielectric layer is preserved in the previous processing, the dielectric layer has a predetermined thickness greater than the minimum required thickness for use as a polishing or etching stop layer and can be effectively used on a semiconductor chip to produce electronic components.
[0039] Now referring to the drawings in particular in detail, the same reference numerals in all the drawings indicate similar or identical elements, starting with FIG. 2, a cross-section of the substrate 102. The substrate represents a part of the IC. ...
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