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Polyamic acid composition and transparent polyimide film using same

A technology of polyamic acid and composition, which is applied in the field of transparent polyimide film, can solve problems such as easy bending or twisting, and achieve the effects of low yellowness, excellent mechanical properties, excellent physical properties and product reliability

Pending Publication Date: 2021-08-06
DOOSAN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when colorless and transparent polyimide is used as substrate and optical coatings and films, there are problems such as bending or twisting due to the high coefficient of thermal expansion.

Method used

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  • Polyamic acid composition and transparent polyimide film using same
  • Polyamic acid composition and transparent polyimide film using same
  • Polyamic acid composition and transparent polyimide film using same

Examples

Experimental program
Comparison scheme
Effect test

manufacture example

[0162] The production example of the polyimide film when the above-mentioned thermal imidization method and chemical imidization method are used together will be described more specifically. A dehydrating agent and an imidization catalyst are put into a polyamic acid solution, and cast on a support body. After coating, the dehydrating agent and the imidization catalyst are activated by heating at 80 to 300° C., preferably at 150 to 250° C., thereby partially curing and drying the polyimide film.

[0163] The thickness of the polyimide film of the present invention thus formed is not particularly limited, and can be appropriately adjusted according to the field of application. For example, it may be in the range of 10 to 150 μm, preferably in the range of 10 to 80 μm.

[0164] The transparent polyimide resin film of the present invention can be applied to various fields, and specifically can be applied to substrates or protective films of flexible displays and the like. In thi...

Embodiment 1

[0169] 1-1. Production of polyamic acid composition

[0170] After charging 204.917 g of N,N-dimethylacetamide (N,N-Dimethylacetamide, hereinafter represented by DMAc) into a 500 ml 3-neck round bottom flask, the temperature of the reactor was raised to 50° C., and 2,2 '-Bis(trifluoromethyl)-4,4'-diaminobiphenyl (2,2'-Bis(trifluoromethyl)-4,4'-Diaminobiphenyl, hereinafter represented by TFDB) 15.0 g (95 mol%) and below 1.488 g (5 mol%) of the triamine represented by chemical formula 3a was stirred for 1 hour to completely dissolve the above-mentioned monomer. Next, 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (2,2-bis(3,4-dicarboxyphenyl)Hexafluoropropane dianhydride, hereinafter represented by 6FDA) and pyromellitic acid di After adding 17.523 g (80 mol%) and 2.151 g (20 mol%) of anhydride (Pyromellitic dianhydride, hereinafter represented by PMDA) sequentially, it cooled to 30 degreeC and dissolved.

[0171] [chemical formula 3a]

[0172]

[0173] 1-2. ...

Embodiment 2

[0176] 1-1. Production of polyamic acid composition

[0177] Under the same conditions as above-mentioned Example 1, after loading DMAc 220.478g in the round-bottomed flask, the temperature of the reactor was raised to 50°C, and TFDB 15.0g (90mol%) and triamine 3.141g ( 10mol%), the above monomer was stirred for 1 hour to dissolve it completely. Next, 18.497 g (80 mol%) of 6FDA and 2.270 g (20 mol %) of PMDA were respectively added in sequence, and then cooled to 30° C. for dissolution.

[0178] 1-2. Production of transparent polyimide film

[0179] The production process of the colorless and transparent polyimide film was carried out in the same manner as in Example 1 above.

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Abstract

The present invention provides a polyamic acid composition comprising triamine having a specific structure capable of forming cross-linking bonds, a polyamic acid formed from the polyamic acid composition, and a transparent polyimide film having improved optical characteristics and mechanical characteristics at the same time through imidization of the polyamic acid.

Description

technical field [0001] The present invention relates to a polyamic acid composition comprising a triamine having a specific structure capable of forming a cross-linked bond, a polyamic acid formed from the composition, and imidization of the polyamic acid to improve optical and mechanical properties at the same time transparent polyimide film. Background technique [0002] Polyimide (polyimide, PI) resin generally refers to the solution polymerization of aromatic dianhydrides and aromatic diamines or aromatic diisocyanates to produce polyamic acid derivatives, which are dehydrated under high temperature for imide High heat-resistant resin produced by amination. Such a polyimide resin is an insoluble and infusible ultra-high heat-resistant resin, which has excellent characteristics in thermal oxidation resistance, heat resistance characteristics, radiation resistance, low temperature characteristics, chemical resistance, etc., so it is used in automobiles. It is used in a w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08L79/08C08J5/18G02F1/1333
CPCC08L79/08G02F1/1333C08G73/10C08J5/18C08G73/1017C08G73/1032G02F1/133305C08L2201/10C08J2379/08
Inventor 安炅日金东演李浩庸
Owner DOOSAN CORP
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