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Ultraviolet curable silicone adhesive composition and cured product of same

A pressure-sensitive adhesive and curing technology, applied in the direction of polymer adhesive additives, non-polymer adhesive additives, adhesives, etc., can solve the problem of large dimensional error of coating patterns and achieve good dimensional accuracy , Curing shrinkage rate is small, the effect of curing shrinkage is small

Active Publication Date: 2021-08-06
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, if a heat-curable solvent-free silicone pressure-sensitive adhesive is used, there is a problem that the cured product shrinks when it is cooled to room temperature after heat-curing, and the dimensional error of the coating pattern becomes large.

Method used

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  • Ultraviolet curable silicone adhesive composition and cured product of same
  • Ultraviolet curable silicone adhesive composition and cured product of same
  • Ultraviolet curable silicone adhesive composition and cured product of same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~4

[0172] [Examples 1-4, Reference Examples 1-2]

[0173] Mix the above-mentioned (A)-(B) components in the ratio of Table 1, and distill off the toluene at 100°C under reduced pressure, then add (C)-(E) components in the ratio of Table 1, and use a planetary mixer They were mixed to prepare each silicone composition described in Table 1.

[0174] It should be noted that the viscosity of the composition in Table 1 is a value at a frequency of 10 Hz measured at 23° C. using a viscosity / viscoelasticity measuring device (MARS manufactured by HAAKE Co., Ltd.), and the thixotropic ratio is obtained from the viscosity at a frequency of 1 Hz at 23° C. Calculate the ratio A / B of A to viscosity B at a frequency of 10 Hz.

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PUM

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Abstract

An ultraviolet-curable silicone pressure-sensitive adhesive composition according to the present invention can form a cured product having good shape retention, low curing shrinkage, and excellent adhesiveness as a temporary fixing material. The ultraviolet curable silicone adhesive composition which contains (A) an organopolysiloxane represented by formula (1) (wherein each R1 represents a polymerizable group or a monovalent hydrocarbon group having 1-20 carbon atoms, provided that at least one of the R1 moieties represents a polymerizable group; R2 represents an oxygen atom or an alkylene group having 1-20 carbon atoms; and m and n represent numbers satisfying m >= 0, n >= 1 and 1 <= (m + n) <= 1,000), (B) an organopolysiloxane resin which is composed of (a) an R3 3SiO1 / 2 unit (wherein R3 represents a monovalent hydrocarbon group having 1-10 carbon atoms) and (b) an SiO4 / 2 unit, with the molar ratio of the unit (a) to the unit (b) being 0.6-1.2:1, (C) a fine silica powder and (D) a photopolymerization initiator.

Description

technical field [0001] The present invention relates to an ultraviolet-curable silicone pressure-sensitive adhesive composition and its cured product, and more particularly, to an ultraviolet-curable silicone pressure-sensitive adhesive that can be suitably used in a temporary fixing material for transferring objects agent composition and its cured product. Background technique [0002] In recent years, electronic devices such as smartphones, liquid crystal displays, and automotive components have been pursuing not only high performance, but also space saving and energy saving. The electrical and electronic components mounted in response to the demands of such a society are also miniaturized, and its assembly process is becoming more and more complicated and difficult every year. [0003] In recent years, technologies capable of selectively and collectively transferring such miniaturized elements and parts have been developed and attracted attention (Non-Patent Document 1)....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J7/38C09J11/04C09J11/06C09J11/08
CPCC09J7/38C09J2483/00C08G77/20C09J183/06C08G77/70C08L83/00C08K3/36C09J183/04C08F290/06C09J11/04C09J11/06C09J11/08C09J2301/312C09J2301/416C09J2301/302C09J2203/326
Inventor 北川太一松本展明大竹滉平
Owner SHIN ETSU CHEM IND CO LTD
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