Ceramic part cleaning method

Abstract

The embodiment of the invention provides a ceramic part cleaning method. The ceramic part cleaning method comprises the following steps of a first cleaning process, specifically, particles on a ceramic part are dissolved by adopting a chemical solution; a second cleaning process, specifically, a specified acid solution is adopted to soften and corrode the particles on the ceramic part and eliminate a damaged layer on the ceramic part; and a third cleaning process, specifically, the ceramic part is cleaned in an ultrasonic cleaning mode so as to remove the particles and the solution remaining on the ceramic part. According to the ceramic part cleaning method provided by the embodiment, the suspended particles and the damaged layer on the ceramic part can be effectively removed, so that the problem that the number of the ceramic particles exceeds the standard can be solved, and the chip yield is improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a cleaning method for ceramic parts. Background technique [0002] As the foundation and core of the information industry, integrated circuits are an overall strategic industry related to national economic and social development. Due to the small size of trenches and line widths in integrated circuits, tiny particles can cause great damage to the process results of wafers (such as silicon wafers). The problem of particle pollution has seriously restricted the development of the integrated circuit field to lower technology nodes. extend. Particle control ability is also an important index to measure equipment stability and process stability in integrated circuit technology. Especially in the current advanced process, the requirements for particle control are getting higher and higher, which puts forward the requirements for integrated circuit equipment. Greater challen...

AI Technical Summary

Problems solved by technology

However, this material will inevitably produce some powdery particles on the surface during the molding process of granulation, sintering and machining. Once these particles fall on the wafer during the semiconductor manufacturing process, it may affect Process results, such as the conduction of different wires, the disconnection of the same wire, the formation of holes, resulting in greater energy consumption and heat generation, etc.

These particles, if not removed, can seriously impact process results and chip yields

[0004] In order to remove the particles on the ceramic parts, it is necessary to clean the ceramic parts. However, the existing cleaning methods for ceramic parts are difficult to clean the ceramic parts. The damaged layer and suspended particles on the ceramic parts still exist, which cannot meet the requirements for the number of particles. Require

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