Boron nitride composite thermal interface material

A thermal interface material, boron nitride technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of thermal interface layer failure, electronic component pollution, poor conductivity, etc., to improve thermal conductivity, Guaranteed insulating properties, avoiding the effect of overflow

CN113265227AInactive Publication Date: 2021-08-17苏州浩科通电子科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2021-08-17
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a boron nitride composite thermal interface material which comprises a high polymer material matrix, a boron nitride heat conduction filler and a phase change heat conduction filler; the boron nitride heat conduction filler and the phase change heat conduction filler fill into the high polymer material matrix in a blending manner. According to the invention, the boron nitride heat conduction filler can significantly improve the overall heat conductivity of the thermal interface material and ensure the insulation characteristic of the thermal interface material; the phase change heat conduction filler provides the capability of solving instantaneous high heat flow or periodic high heat flow for the thermal interface material by utilizing phase-change latent heat of the phase-change heat conduction filler; the high polymer material matrix ensures the flexibility and compressibility of the thermal interface material, can fully fill the gap between the electronic component and the heat dissipation module, and also serves as a carrier of the phase change heat conduction filler, so that the problem of overflow of the traditional phase change material is avoided.
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Description

technical field

[0001] The invention belongs to the technical field of thermal interface materials, and in particular relates to a boron nitride composite thermal interface material. Background technique

[0002] Due to the increasing miniaturization, light weight and high integration of microelectronic devices in recent years, the heat dissipation of heating elements such as chips in electronic equipment has become one of the important reasons restricting its development. In order to solve the heat dissipation problem, the most commonly used method at present is to fill the gap between the electronic component and the heat dissipation module with a thermal interface material to reduce the contact thermal resistance and improve the heat conduction efficiency. In general, thermal interface materials are required to have high out-of-plane thermal conductivity and good insulation properties to prevent electronic components from leaking or short-circuiting to cause failure, and ...

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Embodiment Construction

[0021] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, and are not intended to limit the protection scope of the present invention.

[0022] The application principle of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0023] Such as figure 1 As shown, the present invention provides a boron nitride composite thermal interface material 10, including: a polymer material matrix 11, a boron nitride thermally conductive filler 12 and a phase change thermally conductive filler 13; the boron nitride thermally conductive filler 12 and phase The variable thermal conductivity filler 13 is filled into the polymer material matrix 11 by blending.

[0024] In a specific e...