Boron nitride composite thermal interface material

Abstract

The invention discloses a boron nitride composite thermal interface material which comprises a high polymer material matrix, a boron nitride heat conduction filler and a phase change heat conduction filler; the boron nitride heat conduction filler and the phase change heat conduction filler fill into the high polymer material matrix in a blending manner. According to the invention, the boron nitride heat conduction filler can significantly improve the overall heat conductivity of the thermal interface material and ensure the insulation characteristic of the thermal interface material; the phase change heat conduction filler provides the capability of solving instantaneous high heat flow or periodic high heat flow for the thermal interface material by utilizing phase-change latent heat of the phase-change heat conduction filler; the high polymer material matrix ensures the flexibility and compressibility of the thermal interface material, can fully fill the gap between the electronic component and the heat dissipation module, and also serves as a carrier of the phase change heat conduction filler, so that the problem of overflow of the traditional phase change material is avoided.

Description

technical field [0001] The invention belongs to the technical field of thermal interface materials, and in particular relates to a boron nitride composite thermal interface material. Background technique [0002] Due to the increasing miniaturization, light weight and high integration of microelectronic devices in recent years, the heat dissipation of heating elements such as chips in electronic equipment has become one of the important reasons restricting its development. In order to solve the heat dissipation problem, the most commonly used method at present is to fill the gap between the electronic component and the heat dissipation module with a thermal interface material to reduce the contact thermal resistance and improve the heat conduction efficiency. In general, thermal interface materials are required to have high out-of-plane thermal conductivity and good insulation properties to prevent electronic components from leaking or short-circuiting to cause failure, and ...

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Problems solved by technology

[0004] Aiming at the poor conduction performance of traditional thermal interface materials for transient high heat flow and periodic heat flow, phase change materials are easy to overflow the contact surface of electronic components and heat dissipation modules as thermal interface materials, resulting in failure of thermal interface layer and pollution of electronic components , the present invention proposes a boron nitride composite thermal interface material, which combines the advantages of traditional thermal interface materials and phase change materials, while avoiding the disadvantages of both, so that the thermal interface material can cope with transient high heat flow and cycle At the same time, there will be no failure and contamination problems caused by thermal interface material overflow

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