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Air guide plate and method for improving poor ink plugging of circuit board windowing VIA hole

A technology of air guide plate and air guide hole, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., to reduce the efficiency loss, reduce the process of solder mask plug holes, and improve the efficiency of solder mask production.

Inactive Publication Date: 2021-08-17
DALIAN CHONGDA CIRCUIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the existing technical defects and provide an air guide plate, which can avoid overlapping holes on the production plate by using trapezoidal grooves and inverted V-shaped support parts, so as to ensure that the production plate is There will be no hole plugging during solder mask silk screen printing, thus avoiding the problem of bad hole plugging

Method used

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  • Air guide plate and method for improving poor ink plugging of circuit board windowing VIA hole
  • Air guide plate and method for improving poor ink plugging of circuit board windowing VIA hole

Examples

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Embodiment 1

[0031] like Figure 1-Figure 2 As shown, a kind of air guiding plate shown in this embodiment includes a flat plate 1 with a flat surface and a square shape. The upper surface of the plate 1 is provided with several grooves 2 at intervals along its length or width direction. The grooves 2 The cross-section is a trapezoid with a large top and a small bottom, so that the adjacent grooves 2 are separated by an inverted V-shaped support part 3, and at least one air guide hole 4 is provided through the bottom of the groove 2, and the air guide hole can be used for the entire single The grooves are vacuumed, and the upper surface of the flat plate 1 is surrounded by planes 11. After the air guide plate and the production plate are aligned and fixed by using the planar structure, the inner grooves form a sealed structure to realize the air guide holes. Vacuuming operation; in the above, the trapezoidal groove and the inverted V-shaped support part of the air guide plate can prevent t...

Embodiment 2

[0037] A method for making a circuit board shown in this embodiment, which includes a method for improving the poor ink plug hole of the VIA hole of the circuit board window, adopts the air guide plate as described in Example 1 to carry out ink plug hole production, wherein the production board The edge of the plate corresponds to the edge of the air guide plate, and the graphic area of ​​the production plate corresponds to the groove area on the air guide plate. The specific process is as follows:

[0038] (1) Cutting: cut out the core board according to the panel size 520mm×620mm, the thickness of the core board is 0.5mm, and the thickness of the outer layer of copper foil is 0.5oz.

[0039](2) Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat a photosensitive film on the core board, the film thickness of the photosensitive film is controlled at 8 μm, and a fully automatic exposure machine is used to ...

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Abstract

The invention discloses an air guide plate and a method for improving poor ink plugging of a circuit board windowing VIA hole, the air guide plate comprises a flat plate with a flat surface, the upper surface of the flat plate is provided with a plurality of grooves at intervals along the length or width direction of the flat plate, the cross section of each groove is a trapezoid with a large upper part and a small lower part, the adjacent grooves are separated through inverted-V-shaped supporting parts, at least one air guide hole is formed in the bottom of each groove in a penetrating mode, and the peripheral plate edges of the upper surface of the flat plate are all planes. By means of the trapezoidal groove and the inverted-V-shaped supporting part in the air guide plate, the situation that holes in the production plate coincide with the air guide plate can be avoided, it is ensured that the phenomenon of hole blocking cannot occur when the production plate is subjected to solder mask printing, and therefore the problem of poor hole blocking is avoided.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to an air guide plate and a method for improving ink plug hole defects in VIA holes of circuit board windows. Background technique [0002] With the development of electronic information technology, electronic products are becoming more and more portable, and the circuit boards are becoming more and more precise. Due to the wiring design and welding requirements, the requirement of opening VIA holes and blocking holes is becoming more and more common. [0003] The existing VIA fenestration plug holes are currently generally used in the form of resin plug holes or solder mask ink plug holes, and the solder mask ink plug hole methods include the normal process flow of solder mask ink plug holes and the process flow of solder mask ink plug hole ink dots Two types; among them, the process of resin plug hole is: pre-process→sinking copper plate electrical→resin p...

Claims

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Application Information

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IPC IPC(8): H05K3/42
CPCH05K3/42H05K3/423
Inventor 孙淼黄国平李克海肖德东
Owner DALIAN CHONGDA CIRCUIT
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