A kind of high-performance bonded platinum alloy fine material for encapsulation and preparation method thereof

A platinum alloy, high-performance technology, applied in the field of high-performance bonded platinum alloy micro-materials for packaging and its preparation, to achieve the effects of uniform alloy composition without segregation, uniform and adjustable performance, and high dimensional accuracy

Active Publication Date: 2022-03-01
BEIJING INST OF NONFERROUS METALS & RARE EARTH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] It can be seen that platinum alloy has a wide range of applications in national economic fields such as electrical contact materials due to its special advantages of high strength, high hardness and corrosion resistance. The product forms mainly include plate, strip, rod and wire. However, there are few reports on platinum alloys as packaging bonding materials, and there are few reports on fine materials.

Method used

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  • A kind of high-performance bonded platinum alloy fine material for encapsulation and preparation method thereof
  • A kind of high-performance bonded platinum alloy fine material for encapsulation and preparation method thereof
  • A kind of high-performance bonded platinum alloy fine material for encapsulation and preparation method thereof

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preparation example Construction

[0040] The preparation method of the above-mentioned platinum alloy fine material comprises the following steps: 1. Preparation of master alloy; 2. Cast alloying of "continuous down drawing + directional solidification"; 3. "Rough drawing + online annealing + fine drawing"; 4. "Precise drawing Rolling + online resistance heating softening treatment".

[0041] 1) Master alloy preparation: In order to reduce burning loss and ensure the uniformity of alloy composition, Pt-Dy and Pt-Eu master alloys were first prepared by vacuum intermediate frequency induction melting method; the conditions were: vacuum degree 1.0×10 -3 Pa~1.0×10 -4 Pa, the smelting temperature is 1600-2000°C, after complete melting, stand for 1-3 minutes for refining, then close the vacuum, fill with argon, and quickly cast it into a water-cooled copper mold to obtain an intermediate alloy ingot.

[0042] 2) Alloying: The down-drawing continuous casting method is adopted, and a forced means is used during the s...

Embodiment 1

[0050] Preparation of Pt-10Dy and Pt-10Eu master alloys:

[0051] Put 500g of Pt into the crucible and evacuate to 1×10 -3 Below Pa, raise the temperature to 2000°C, after the Pt is completely melted, add 50g of Dy or Eu by post-feeding method when the temperature drops to 1600°C, until the temperature drops to 1400°C after the melt is completely melted, stand for refining for 3-5min, and then Under the protection of argon or nitrogen, it is quickly cast into a water-cooled copper mold, so that the uniformity of the composition can be achieved through instantaneous cooling, and Pt-10Dy and Pt-10Eu master alloys are obtained.

Embodiment 2

[0053] Prepare a high-performance bonded platinum alloy fine flat ribbon with a thickness of 12.5 μm and a width of 75 μm for high-end electronic packaging. In the platinum alloy, Ir: 0.5wt%, Ge: 1.0wt%, (Be+Dy): 0.03wt%, The balance is Pt.

[0054] 1. "Down-drawing continuous casting + directional solidification" alloying. Put 5gIr, 10gGe, 0.2gBe, 1gPt-10Dy master alloy (prepared in Example 1) and 983.8gPt into the crucible, vacuumize and heat to 2000°C for melting; carry out down-draw continuous casting, and the continuous casting speed is controlled at 50mm / min, The alloy melt temperature is controlled at 1750°C, the cooling water temperature at the continuous casting outlet is controlled below 25°C, and the cooling water flow range is 150L / h to ensure the crystallization speed of the melt and the stability of directional solidification, so as to realize Φ8mm single crystal Near net shape of billets.

[0055] 2. "Online annealing + drawing". The fine platinum alloy wire ...

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Abstract

The invention relates to a high-performance bonding platinum alloy fine material for packaging and a preparation method thereof, belonging to the technical field of packaging bonding materials. The weight percent of each component of the bonded platinum alloy fine material is: Ir: 0% to 60%, Ge: 0% to 5.0%, one or more of Be, Dy and Eu, and the total of Be, Dy and Eu The content is 0.03% to 0.1%, and the balance is Pt. The preparation steps include preparation of master alloy, down drawing continuous + directional solidification casting alloying, rough drawing + online annealing + fine drawing and precision rolling + online resistance heating softening treatment. The alloy has the advantages of high purification, ultra-fineness, and high refinement. It also has the advantages of high strength, good corrosion resistance, long service life, and meets the needs of extreme harsh environments. It is suitable for packaging and bonding requirements in special fields, especially It is of great significance to the development of high-end semiconductor devices to meet the application requirements of narrow chip pitch miniaturization, high reliability and high stability.

Description

technical field [0001] The invention relates to a high-performance bonding platinum alloy fine material for packaging and a preparation method thereof, belonging to the technical field of packaging bonding materials. Background technique [0002] Wire bonding is a method of using thin metal wires, using heat, pressure, and ultrasonic energy to tightly weld the metal wires and substrate pads to achieve electrical interconnection between chips and substrates and information exchange between chips. It is commonly used in the field of microelectronics. packaging material. The types of bonding wires have developed from traditional bonding gold wires and bonding aluminum wires to the current multi-species and models. In the past ten years, bonding copper wires, bonding silver wires, bonding gold wires, and bonding wires have been developed in the past ten years. Silver alloy wire, bonded palladium-plated copper wire and bonded gold-plated silver wire, etc. The specifications of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C5/04C22F1/02C22F1/14B22D11/00C21D9/52C22C1/03H01L21/48H01L23/00B21B1/16B21B3/00B21C1/00B21C1/02B21C37/04
CPCC22C5/04C22C1/03C22F1/02C22F1/14C21D9/525B22D11/001B21C37/047B21C1/003B21C1/02B21B3/00B21B1/166H01L24/45H01L24/43H01L21/4885H01L21/4896H01L2224/45169H01L2224/43H01L2224/432H01L2224/4321H01L2224/43848
Inventor 柳旭王炜张京叶陈怡兰王峰范树辉马天俊徐钊
Owner BEIJING INST OF NONFERROUS METALS & RARE EARTH
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