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Quantum dot LED packaging device and preparation method thereof

A technology of LED packaging and quantum dots, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of uneven quenching center, high blue light composition, high cost, etc., achieve uniform light output, reduce blue light intensity, and increase coupling degree Effect

Active Publication Date: 2021-09-03
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a quantum dot LED packaging device and its preparation method, which can solve the problem of high blue light content in existing quantum dot LED packaging devices, reduce user experience, and high difficulty in the preparation process of large-area quantum dot films. High cost, difficult to control the thickness uniformity, a large number of uneven quenching centers locally formed, affecting the display effect and other issues

Method used

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  • Quantum dot LED packaging device and preparation method thereof
  • Quantum dot LED packaging device and preparation method thereof
  • Quantum dot LED packaging device and preparation method thereof

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Embodiment Construction

[0029] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, to fully introduce the technical content of the present invention to those skilled in the art, to prove that the present invention can be implemented, to make the technical content disclosed in the present invention clearer, and to make the technical content of the present invention clearer. It is easier for those skilled in the art to understand how to implement the present invention. However, the present invention can be realized through many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned herein, and the descriptions of the following embodiments are not intended to limit the scope of the present invention.

[0030] The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc...

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Abstract

The invention relates to a quantum dot LED packaging device and a preparation method thereof. The quantum dot LED packaging device comprises a substrate, a support, a circuit layer, an LED chip, a micro lens, a filter layer and an extinction layer. The filter layer is mounted on one side, away from the substrate, of the micro lens, so that the blue light intensity is reduced, and the blue light is reduced to a healthy value; the surface of one side, away from the substrate, of the filter layer is a rough surface, so that the effect of uniformly emitting light is realized; scattering particles are added in the filter layer and used for increasing the coupling degree of light penetrating through the micro lens, and scattering and light uniformizing are carried out on the light penetrating through the micro lens; and the extinction layer is arranged around the filter layer and is used for shielding LED blue light which is not absorbed by the quantum dot material.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a quantum dot LED packaging device and a preparation method thereof. Background technique [0002] Quantum dot (English full name: Quantum Dot, referred to as QD) TV has been widely praised since its launch. Due to the many excellent properties of quantum dot materials, the new LCD display combined with LCD and quantum dot backlight has a wide color gamut. Excellent display effect with high color saturation and color purity, its color and display quality are approaching or even surpassing the trend of OLED displays. [0003] At present, quantum dot TVs are in the form of quantum dot backlight and LCD display panel. The quantum dot backlight mostly adopts the optical structure of blue LED chip and quantum dot film. The trend is against the trend, and the preparation of large-area quantum dot films is difficult, extremely costly, and difficult to control the thickness u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/58H01L33/52
CPCH01L33/48H01L33/50H01L33/58H01L33/52
Inventor 向昌明
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD