Additive manufacturing device and method based on meniscus constrained electrodeposition

A technology of additive manufacturing and meniscus, applied in the field of additive manufacturing, can solve the problems of high porosity of deposits, poor surface finish, simple structure, etc.

Pending Publication Date: 2021-09-07
CHANGCHUN UNIV OF SCI & TECH
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Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide an additive manufacturing device and method based on meniscus-constrained electrodeposition to solve the problem of high porosity and smooth surface in the deposits formed by the existing electrochemical three-dimensional electrodeposition technology. Poor performance, simple structure and other technical problems

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  • Additive manufacturing device and method based on meniscus constrained electrodeposition
  • Additive manufacturing device and method based on meniscus constrained electrodeposition
  • Additive manufacturing device and method based on meniscus constrained electrodeposition

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Embodiment Construction

[0037] Additive manufacturing devices based on meniscus-confined electrodeposition, such as Figure 1 ~ Figure 3 As shown, it includes a vibration isolation module 1, an additive manufacturing motion platform 2, a precise positioning module 3, a monitoring module 4 and an electrode module 5,

[0038] The vibration isolation module 1 includes a vibration isolation platform 101 , a control system frame vehicle 102 , a precise positioning controller 103 , a potentiostat module 104 , a pipette air pressure controller 105 , a macro movement controller 106 and a general control system 107 . The vibration isolation platform 101 is the base of the additive manufacturing motion platform 2, which is responsible for offsetting the vibration of the entire system from the outside; the bottom of the control system frame car 102 is equipped with 4 rollers, which can be moved, and the control system frame car is equipped with The components of the entire control system, the uppermost layer is...

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Abstract

The invention discloses an additive manufacturing device and method based on meniscus constrained electrodeposition, and belongs to the technical field of additive manufacturing. The additive manufacturing device comprises a vibration isolation module, an additive manufacturing motion platform, a precision positioning module, a monitoring module and an electrode module. By utilizing a meniscus constrained electrodeposition technology, electrodeposition is carried out in a liquid meniscus between the tip of a transfer pipette and a conductive substrate, a liquid bridge extends in multiple directions under movement of a movable sliding table, the relative positions of the substrate and the transfer pipette are compensated through precise cooperation movement of a six-axis PI motion console and the movable sliding table, the stable liquid bridge is continuously kept between the substrate and the transfer pipette, and therefore a complex uniform deposition structure with high quality, high compactness and high surface smoothness is formed. Forward micro-additive manufacturing of the submicron glass transfer pipette is achieved in a real sense, mechanical micro-motion and a microfluid technology are integrated through a localized electrochemical technology, and the whole deposition process is more stable and has higher ductility.

Description

technical field [0001] The invention belongs to the technical field of additive manufacturing, and in particular relates to an additive manufacturing device and method based on meniscus constrained electrodeposition. Background technique [0002] Electrochemical deposition technology, referred to as electrodeposition, is a typical additive processing method that is formed by layer-by-layer accumulation. Electrodeposition technology based on aqueous solution generally has the advantages of a wide range of applicable materials, low operating temperature (generally below 70 °C), synergistic control of structure-morphology-performance, and wide application fields. In theory, as long as the reduced metal atoms are induced to stack up controllably according to the design intention, the electrodeposition technology can be used to process or print metal structures and parts of arbitrary shapes. For this reason, the academic circles and the industry have conducted research on electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/00B33Y10/00B33Y30/00
CPCC25D1/003B33Y10/00B33Y30/00
Inventor 许金凯徐振铭任万飞邹兆强孙晓晴田坤
Owner CHANGCHUN UNIV OF SCI & TECH
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