Pulse-assisted electrochemical deposition metal pipeline inner wall coating device and preparation method

Abstract

The invention relates to the technical field of non-traditional machining, in particular to a pulse-assisted electrochemical deposition metal pipeline inner wall coating device and a preparation method. The device comprises a servo motor, a cable winder, a cable, a liquid storage tank, a plating bin, a sealing rubber ring, an anode pipe sleeve, a liquid absorption cotton felt, an anode conductive bolt, a cathode conductive probe, a pulse power supply and a pipe orifice cable guide anti-abrasion roller sleeve. The liquid absorption cotton felt outside the plating bin clings to the inner wall of the pipeline for plating, the electrolyte storage and supply circulating filtration system supplies electrolyte to the plating bin, and the pulsed power supply generates an electric field at the contact part of the inner wall of the pipeline and the plating bin through the anode conductive bolt and the cathode conductive probe, so that positive ions in the electrolyte are deposited on the surface of the inner wall of the pipeline to form a plating layer. And by adjusting the feeding speed, the current density, the electrolyte circulating speed, the pH value, the temperature and the like, the pipeline inner wall coating which is good in uniformity, compact in structure and good in film-substrate binding force is prepared.

Description

technical field [0001] The invention relates to the technical field of special processing, in particular to a pulse-assisted electrochemical deposition metal pipeline inner wall coating device and a preparation method. Background technique [0002] Electrochemical deposition technology refers to the migration of positive and negative ions in the electrolyte under the action of an external electric field, and the oxidation-reduction reaction of metal ions that migrate to the cathode substrate material to obtain a metal coating. Its basic process is divided into: liquid phase mass transfer, pre-transformation, charge transfer, and electrocrystallization. It is widely used because it can obtain a metal coating with good bonding force and different properties from the substrate material on the surface of the substrate to achieve corrosion resistance, wear resistance, and performance improvement. At present, the commonly used technologies of electrochemical deposition technology...

AI Technical Summary

Problems solved by technology

In the existing technology, the electrochemical deposition technology has certain limitations in the plating and deposition of the inner wall of the metal pipe, such as: the inner wall of the metal pipe is difficult to electrodeposit, the gap between the cathode and the anode of the electrodeposition is too large, which leads to anode passivation, and the structure and thickness of the deposited layer are not good. Evenly etc.

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