Pulse-assisted electrochemical deposition metal pipe inner wall coating device and preparation method

Abstract

The invention relates to the technical field of special processing, in particular to a pulse-assisted electrochemical deposition metal pipeline inner wall coating device and a preparation method. The device includes a servo motor, a cable reel, a cable, a liquid storage tank, a plating chamber, a sealing rubber ring, an anode sleeve, a liquid-absorbing cotton felt, an anode conductive bolt, a cathode conductive probe, a pulse power supply, and a nozzle guide cable. Grinding roller sleeve, the servo motor and cable reel pull the plating bin to reciprocate in the pipeline through the cable, the liquid-absorbing cotton felt outside the plating bin is close to the inner wall of the pipe for plating, and the electrolyte is stored and supplied to the plating bin by the circulating filter system For the electrolyte, the pulse power supply generates an electric field at the contact part between the inner wall of the pipeline and the plating chamber through the anode conductive bolt and the cathode conductive probe, so that the cations in the electrolyte are deposited on the surface of the inner wall of the pipeline to form a coating. By adjusting the feed speed, current density, electrolyte circulation speed, pH, temperature, etc., the coating on the inner wall of the pipeline with good uniformity, compact structure and good film-base bonding force is prepared.

Description

technical field [0001] The invention relates to the technical field of special processing, in particular to a pulse-assisted electrochemical deposition metal pipeline inner wall coating device and a preparation method. Background technique [0002] Electrochemical deposition technology refers to the migration of positive and negative ions in the electrolyte under the action of an external electric field, and the oxidation-reduction reaction of metal ions that migrate to the cathode substrate material to obtain a metal coating. Its basic process is divided into: liquid phase mass transfer, pre-transformation, charge transfer, and electrocrystallization. It is widely used because it can obtain a metal coating with good bonding force and different properties from the substrate material on the surface of the substrate to achieve corrosion resistance, wear resistance, and performance improvement. At present, the commonly used technologies of electrochemical deposition technology...

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Problems solved by technology

In the existing technology, the electrochemical deposition technology has certain limitations in the plating and deposition of the inner wall of the metal pipe, such as: the inner wall of the metal pipe is difficult to electrodeposit, the gap between the cathode and the anode of the electrodeposition is too large, which leads to anode passivation, and the structure and thickness of the deposited layer are not good. Evenly etc.

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