Heat dissipation assembly and device of electronic equipment and electronic equipment

Abstract

The invention provides a heat dissipation assembly of electronic equipment. The heat dissipation assembly comprises a heat conduction magnetic base body, a plurality of heat dissipation fins, a transmission assembly and a movable cover plate. The heat conduction magnetic base body is provided with a containing groove, one end of each heat dissipation rib abuts against the heat conduction magnetic base body, the movable cover plate covers the heat conduction magnetic base body, and the transmission assembly is used for opening and closing the movable cover plate; when the movable cover plate is closed, the radiating fins are in a horizontal closed state and are accommodated in the accommodating grooves; and when the movable cover plate is opened, the heat dissipation fins are in a vertical expansion state through the magnetic attraction force of the heat conduction magnetic base body, and then heat of the electronic equipment can be dissipated through the heat conduction magnetic base body and the multiple heat dissipation fins in the vertical expansion state. The invention further provides a heat dissipation device of the electronic equipment and the electronic equipment. According to the heat dissipation assembly and device of the electronic equipment and the electronic equipment, the heat dissipation specific surface area is large, the heat dissipation efficiency can be improved, the occupied space can be reduced, the structure is simple, and portability is achieved.

Description

【Technical field】 [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation component and device of electronic equipment and electronic equipment. 【Background technique】 [0002] The rapid development of the integrated circuit and semiconductor industry has prompted the processing chips to move towards high performance and high integration, which has also brought about the continuous increase of power density and the problem of power consumption wall. At present, the power consumption of the SOC (System-on-Chip, system-on-chip) of relatively advanced electronic equipment has reached the order of 10W. For the sake of temperature control, the performance of the chip has to be reduced to reduce the user experience, especially the running The frame drop phenomenon is more obvious when playing large games. Therefore, how to dissipate heat from local heat sources more efficiently is equally important as simply improving the energ...

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Problems solved by technology

[0003] At present, the passive cooling solutions for consumer electronics products include: graphite sheet, thermally conductive gel, heat pipe, VC, superconducting metal, etc., which weaken local hot spots by strengthening the temperature uniformity of the internal structure, but the heat ultimately comes from the external surface of the device. Surface natural heat dissipation and thermal radiation dissipate. The passive heat dissipation solution is limited by the heat dissipation surface area of ​​the equipment, and the heat dissipation capacity of the equipment is limited, which leads to the continuous rise of the overall temperature of the equipment.

Active cooling solutions such as: air cooling, semiconductor cooling, water cooling, etc., while active cooling solutions take up a lot of equipment space, while external cooling methods consume power and are not portable

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