Epoxy resin latent curing agent and preparation method thereof

A latent curing agent, epoxy resin technology, applied in chemical instruments and methods, preparation of organic compounds, preparation of carboxylates, etc., can solve problems such as pollution and reducing reactivity

Pending Publication Date: 2021-09-10
ZHEJIANG SCI-TECH UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of modifying imidazole and reducing its reactivity, org

Method used

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  • Epoxy resin latent curing agent and preparation method thereof
  • Epoxy resin latent curing agent and preparation method thereof
  • Epoxy resin latent curing agent and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] (1) Weigh 21.2g of 1,3,5-benzenetricarboxylic acid and 41.0g of dimethylimidazole;

[0047] (2) Stir and mix the imidazole compound and the polycarboxylic acid evenly, put it into a ball mill and mill it at 3000r / min for 2h to obtain a powder;

[0048] (3) Cool the powder to room temperature, take out the powder and stir at 50r / min for 0.5h, then put the powder into an oven at 90°C for a solid-state reaction at a constant temperature for 2h;

[0049] (4) Take out the reaction product and put it into a grinder for cooling at 4000r / min for 1h, then stir at 50r / min for 0.75h to obtain a latent curing agent for epoxy resin containing imidazole groups (code: A);

[0050] (5) Add 14g of the above-mentioned modified imidazole curing agent into 80g of E-51 type epoxy resin and mix evenly at 40°C to obtain a latent medium temperature epoxy resin system A. DSC is tested at a heating rate of 10K / min, and the results are as follows figure 1 shown.

Embodiment 2

[0052] (1) Weigh 25.4g of 1,2,4,5-pyrenetetracarboxylic acid and 82g of dimethylimidazole;

[0053] (2) Stir and mix the imidazole compound and the polycarboxylic acid evenly, put it into a ball mill and mill it at 3500r / min for 2h to obtain a powder;

[0054] (3) Cool the powder to room temperature, take out the powder and stir at 120r / min for 0.5h, then put the powder into an oven at 160°C for a solid-state reaction at a constant temperature for 2h;

[0055] (4) Take out the reaction product and put it into a grinder for cooling at 3500r / min for 2h, then stir at 120r / min for 0.5h to obtain a latent curing agent for epoxy resin containing imidazole groups (code: B);

[0056] (5) Add 10g of the above-mentioned modified imidazole curing agent into 100g E-51 type epoxy resin at 60°C and mix evenly to obtain latent medium temperature epoxy resin system B. DSC is tested at a heating rate of 10K / min, and the results are as follows 2 shown.

Embodiment 3

[0058] (1) Weigh mellitic acid 34.2g and dimethylimidazole 61.5g;

[0059] (2) Stir and mix the imidazole compound and the polycarboxylic acid evenly, put into a ball mill and mill at 4500r / min for 4h to obtain a powder;

[0060] (3) Cool the powder to room temperature, take out the powder and stir at 80r / min for 0.1h, then put the powder into an oven at 190°C for a solid-state reaction at a constant temperature for 10h;

[0061] (4) Take out the reaction product and put it into a grinder for cooling at 3000r / min for 1.5h, then stir for 0.5h at 80r / min to obtain a latent curing agent for epoxy resin containing imidazole groups (code: C);

[0062] (5) Add 22g of the above-mentioned modified imidazole curing agent into 80g E-51 type epoxy resin at 60°C and mix evenly to obtain a latent medium-temperature epoxy resin system C. DSC is tested at a heating rate of 10K / min, and the results are as follows image 3 shown.

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Abstract

The invention discloses an epoxy resin latent curing agent and a preparation method thereof. According to the invention, polybasic carboxylic acid containing a benzene ring and an imidazole compound are used as raw materials, and an imidazolium carboxylate structure is formed at a certain temperature. As a latent curing agent, the epoxy resin latent curing agent can initiate ring-opening polymerization of epoxy resin at a medium temperature, and has good thermal reaction activity and latent heat performance. By introducing alkyl and benzene ring groups, the crosslinking density of the resin can be improved, the performance of the resin can be enhanced, and the epoxy resin latent curing agent has wide research potential and application background in an epoxy resin system.

Description

technical field [0001] The invention relates to the field of epoxy resin curing agents, in particular to a latent curing agent for epoxy resins and a preparation method thereof. Background technique [0002] Epoxy resin is a kind of thermosetting resin, which is widely used in composite sheet, aerospace, construction processing and electronic fields, and is generally made into adhesives, coatings and fiber-based composite materials. However, epoxy resin itself is a thermoplastic material and has no practical value. It must be cross-linked with polyamines, acid anhydrides, and tertiary amine curing agents before it can be used. Once the curing agent is mixed with the resin, it must be used within a short time, otherwise it cannot be used after gelation, resulting in waste and pollution, and the cumbersome batching process causes inefficiency. In order to solve this problem, a latent curing agent is introduced into the epoxy resin system: [0003] That is to say, after the e...

Claims

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Application Information

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IPC IPC(8): C07D233/58C07C51/41C07C63/307C07C63/313C08G59/50
CPCC07D233/58C07C51/412C08G59/5073C07C63/307C07C63/313
Inventor 高俊阔杨海明狄宁宇陆云峰许坤王关全姚菊明
Owner ZHEJIANG SCI-TECH UNIV
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