Manufacturing method for solving nonuniform inflation of copper bath of vertical plating line
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A technology of vertical electroplating and manufacturing methods, which is applied in the direction of electrical components, printed circuit manufacturing, electrolysis process, etc., and can solve problems such as uneven gas pumping of copper tanks
Inactive Publication Date: 2021-09-10
ZHUHAI CHINA EAGLE ELECTRONIC CIRCTCUIS CO LTD
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Problems solved by technology
[0006] Aiming at the deficiencies of the prior art, the present invention provides a manufacturing method to solve the problem of uneven air pumping in the copper tank of the vertical electroplating line, which solves the problem of enhancing the wettability of the copper-plated copper surface and the hole, and the effect of removing air bubbles, and changes the traditional method of the vertical electroplating line. Design, which significantly improves the deep plating ability of PCB high thickness-to-diameter ratio through-hole plating, and improves production quality
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Embodiment 1
[0024] like figure 1 As shown, the embodiment of the present invention provides a method of making a non-uniform air supply of vertical electroplated line copper tanks, including the following steps:
[0025] SP1: Preparation of copper plated liquid: Select the method of copper plating in the PCB board, prepare the instrument, prepare a solution, put the solution into the instrument;
[0026] SP2: Select Additives: Add inorganic additives and organic additives;
[0027] SP3: Mixed stirring: After adding additives, mixing waiting for mixing;
[0028] SP4: Air For breathe: Put the designed air tube into the instrument, and obtain bubbles to the solution;
[0029] SP5: Copper plating: Soak the copper-plated PCB board is soaked in the instrument, waiting to complete the copper plating.
Embodiment 2
[0031] like figure 1As shown, the embodiment of the present invention provides a method for solving uneven gas plating line copper tanks, and the PCB circuit board selects electroplating method, mainly including sulfate type, pyrophosphate type, fluoroboronicate and cyanide Type, cyanide is used as a complexing agent, which is the main purpose to be complex subcoeze ions to prevent precipitation, and the solution is strongly alkaline, with certain activation and removal ability. However, cyanide has a strong toxicity, with wastewater and waste to pollute the environment, and the body health of electroplating workers will also cause serious injuries, fluoroboronicate plating solution, which has good stability, allowed current The density is high, the plating is easy to maintain, but its cost is high, the equipment is large, and the fluoroborrate ions have certain hazards on the environment, and the wastewater treatment is difficult; for pyrophosphate plating solution, the result is...
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Abstract
The invention provides a manufacturing method for solving nonuniform inflation of a copper tank of a vertical plating line, and relates to the technical field of circuit board manufacturing processes. The manufacturing method comprises the following steps that a method for plating copper required by a PCB is selected, an instrument is prepared, a solution is prepared, the solution is put into the instrument, an inorganic additive and an organic additive are added, mixing is carried out after the additives are added, waiting for completion of mixing is carried out, a designed inflating pipe is placed in the instrument, bubbles in the solution are removed, the PCB needing to be plated with copper is soaked in the instrument, and waiting for completion of copper plating is performed. Therefore, the U-shaped inflating pipe is changed into an H shape, due to the fact that connecting ports are located in the middles of the two sides of the H shape, the upward distance or the downward distance of gas is equal, a whole tank body is used for inflating, overall distribution is uniform, the wettability of a copper-plated copper surface and in holes and the bubble removing effect are enhanced, the traditional design of a vertical plating line is changed, the qualified rate of products can be obviously improved, the production quality is improved, the copper plating uniformity is improved, the consumption of copper balls can be reduced, and the cost of the copper balls is saved.
Description
Technical field [0001] The present invention relates to the technical field of circuit board manufacturing process, and in particular, a method for producing non-uniform air inveirs of vertical electroplating line copper tanks. Background technique [0002] Electroplating line, refers to the collectiveness of all electroplating equipment in the electroplating process of industrial products, and the electroplating process must be completed in the order of order, and the electroplating production line is also called electroplating flow wire. Combacha electroplating production line includes full automatic electroplating production line and manual, semi-automatic electroplating production line. The electroplating production line can be divided into a carbon production line, a production line, continuous plating, brush production line, etc., and the printed circuit board is the necessary part of the electronic product, which is a carrier that supports electronic components in electron...
Claims
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Application Information
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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D21/04H05K3/42
CPCC25D3/38C25D21/04H05K3/423
Inventor 李小海周汉刘新发高平安
Owner ZHUHAI CHINA EAGLE ELECTRONIC CIRCTCUIS CO LTD
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