Wafer transmission device and vacuum adsorption manipulator thereof

A vacuum adsorption and manipulator technology, which is applied to conveyor objects, transportation and packaging, electrical components, etc., to solve the problems of falling wafers and inability to absorb warped wafers well.

Inactive Publication Date: 2021-09-14
G H S ADVANCED EQUIP TECH CO LTD
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies in the prior art, the present invention provides a wafer transfer device and its vacuum adsorption manipulator, which has good adsorption of warped wafers, and prevents the wafer from falling due to insufficient adsorption force at the warped portion of the warped wafer. It can be transported in a variety of postures according to working

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer transmission device and vacuum adsorption manipulator thereof
  • Wafer transmission device and vacuum adsorption manipulator thereof
  • Wafer transmission device and vacuum adsorption manipulator thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] As introduced in the background art, there are deficiencies in the prior art. In order to solve the above technical problems, the present application proposes a vacuum suction manipulator for wafer transfer.

[0032] In a typical implementation of the present application, such as Figure 1-8As shown, a vacuum adsorption manipulator for wafer transfer includes a base 1, a support ring 2, a rotating support plate 3, a pillar 4, a rotating structure, a lif...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of vacuum adsorption manipulators, and discloses a wafer transmission device and a vacuum adsorption manipulator thereof. The vacuum adsorption mechanical arm for wafer transmission comprises a base, a supporting ring, a rotating supporting plate, a supporting column, a rotating structure, a lifting structure, a telescopic structure and an adsorption structure, the rotating structure is arranged in the base, the lifting structure is arranged in the base, and the telescopic structure and the adsorption structure are arranged on the supporting column. The rotation structure controls the rotation of the manipulator, the lifting structure controls the up-down movement of the manipulator, the telescopic structure controls the stretching of the manipulator, and the adsorption structure is matched to adsorb and rotate the wafer, so that the adsorption capacity is good, the posture is flexible and adjustable in the adsorption transportation process, the transportation space is small, and the production line investment is reduced; and through single-point adsorption of the telescopic adsorption nozzle, the warped wafer can still be adsorbed on the wafer manipulator, the quality safety of the wafer is guaranteed, reliable adsorption can be achieved in the mode that the wafer is perpendicular to the ground, and the application range is wide.

Description

technical field [0001] The invention relates to the technical field of vacuum adsorption manipulators, in particular to a wafer transfer device and a vacuum adsorption manipulator thereof. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and become an IC with specific electrical functions. product. However, due to the influence of wafer production, the quality of wafers is different, resulting in warped wafers. In many semiconductor processes, it is necessary to use a wafer transfer device to transfer wafers. Existing wafer transfer devices include vacuum suction manipulators, which use the principle of vacuum suction to absorb wafers to transfer wafers to desired positions, and the dynamic control of vacuum suction manipulators mostly uses three-axis roboti...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/683H01L21/67H01L21/677
CPCH01L21/6838H01L21/67265H01L21/67288H01L21/67742
Inventor 尹明清
Owner G H S ADVANCED EQUIP TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap