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LED display module and manufacturing method thereof

A technology for display modules and manufacturing methods, which is applied in the direction of printed circuits, printed circuits, and electrical components connected to non-printed electrical components, and can solve problems such as poor heat dissipation, light decay, small lead welding force, and large device volume. Achieve the effect of improving strength, improving production efficiency, and uniform luminescence

Inactive Publication Date: 2021-09-24
JIANGXI LIANCHUANG NANFEN TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide an LED display module, which solves the problems of small lead welding force, poor moisture-proof effect, and large device volume when SMD devices are used as the light source of the LED display module in the prior art. , poor heat dissipation and serious light decay

Method used

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  • LED display module and manufacturing method thereof
  • LED display module and manufacturing method thereof
  • LED display module and manufacturing method thereof

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Embodiment Construction

[0026] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0027] Such as figure 1 The shown LED display module includes a PCB substrate 1 and an LED flip chip 2, the bottom of the PCB substrate 1 is electrically connected to several connectors 3, and the LED flip chip 2 is mounted on the PCB substrate 1 The upper end surface of the LED flip chip 2 is electrically connected to the PCB substrate 1, a layer of plastic shell 4 is provided directly above the PCB substrate 1, and a layer of panel is provided on the upper end of the plastic shell 4. 5. The circuit pins of the LED flip chip 2 are bound to the pads of the PCB substrate 1 through soldering, and the LED flip chip 2 is packaged on the PCB substrate 1 through optical glue 6, so The optical adhesive 6 completely covers the LED flip chip 2; the optical adhesive 6 is doped with phosphor powder; the bottom surface of the plastic shell 4 is uniformly provided with s...

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Abstract

An LED display module comprises a PCB substrate and an LED flip chip, the bottom of the PCB substrate is electrically connected with a plurality of connectors, the LED flip chip is installed on the upper end face of the PCB substrate, the LED flip chip is electrically connected with the PCB substrate, a layer of plastic shell is arranged over the PCB substrate, a layer of panel is arranged at the upper end of the plastic shell, a circuit pin of the LED flip chip is bound with a bonding pad of the PCB substrate through tin soldering, the LED flip chip is packaged on the PCB substrate through optical cement, and the optical cement completely covers the LED flip chip. According to the invention, the inverted LED flip chip can be directly packaged on the PCB substrate through the optical cement to replace an SMD light source, so that a good sealing protection effect on the welding point and the LED flip chip can be achieved, the water-proof and moisture-proof effects of the light source are facilitated, and the service life of the display module is greatly prolonged.

Description

technical field [0001] The invention relates to the technical field of LED display modules, in particular to an LED display module and a manufacturing method thereof. Background technique [0002] With the increasingly strong demand for quantitative display of the working status of various electrical appliances and industrial control equipment, LED (light-emitting diode) digital tubes have great advantages over liquid crystal displays, making LED digital screens more and more widely used. [0003] At present, the LED display module is implemented by mounting SMD (Surface Mount Device), which has high cost (the LED chip needs to be packaged into a single device before application), the lead welding force is small, the moisture-proof effect is poor, the device is large, and the heat dissipation effect is poor. , severe light decay and other problems. The conventional practice is to continuously improve the reliability of SMD devices, such as using imported raw materials, thic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/54H01L33/62H05K1/18
CPCH01L25/0753H01L33/54H01L33/62H05K1/181H05K2201/10106H01L2933/0066
Inventor 涂俊清刘亮赵彦东李瑞洪肖章权丁永华
Owner JIANGXI LIANCHUANG NANFEN TECHNOLOGY CO LTD
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