Micro light-emitting diode display production detection method and display thereof

A micro-light-emitting diode, production detection technology, applied in static indicators, instruments, etc., can solve the problems affecting the production efficiency of displays, obstacles to rapid mass production of displays, etc., to ensure rapid mass production, improve production efficiency, and reduce complexity. Effect

Pending Publication Date: 2021-09-28
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, the testing process is set after the bonding process. If it is found that there is a damaged micro-LED chip in the display backplane at this time, it needs to debond th

Method used

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  • Micro light-emitting diode display production detection method and display thereof
  • Micro light-emitting diode display production detection method and display thereof
  • Micro light-emitting diode display production detection method and display thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] The production and detection method of a micro-light-emitting diode display of the present invention is described in detail below by taking a production and detection method of a flip-chip display as an example. Please refer to Figure 1 to Figure 7 , which includes:

[0054] S101. Provide a display backplane and set a metal pad assembly on the display backplane

[0055]Provide a display backplane 101, the display backplane 101 is a thin film transistor (TFT, Thin FilmTransistor) backplane; and set more than two metal pad components 104 on the display backplane 101, wherein each metal Pad assembly 104 is made up of two metal pads, which are positive electrode pads and negative electrode pads respectively; the metal pads are made of titanium Ti, gold Au, tin Sn, copper Cu, indium In, silver Ag, platinum Pt, One or several metals in chromium Cr and nickel Ni are formed after coating, exposure, development, etching and stripping.

[0056] S102. Disposing conductive glue ...

Embodiment 2

[0071] Taking the production and detection method of a vertical structure chip display as an example below, a kind of micro light-emitting diode display production and detection method of the present invention is described in detail, please refer to Figure 8 to Figure 15 , which includes:

[0072] S201. Provide a display backplane and set a metal pad assembly on the display backplane

[0073] A display backplane 101 is provided, and the display backplane 101 is a thin film transistor backplane; and more than two metal pad assemblies 104 are arranged on the display backplane 101, wherein each metal pad assembly 104 consists of A metal pad; the metal pad is made of one or more metals in titanium Ti, gold Au, tin Sn, copper Cu, indium In, silver Ag, platinum Pt, chromium Cr, nickel Ni through coating, exposure , development, etching, and stripping.

[0074] S202. Disposing conductive glue on the surface of the metal pad assembly

[0075] The surface of the metal pad is coated...

Embodiment 3

[0091] A micro light-emitting diode display of the present invention is described in detail below with an embodiment of a flip-chip display, please refer to Figure 16 , which includes:

[0092]The display backplane 101 is provided with more than one set of metal pad assemblies 104 on the display backplane 101, and each set of metal pad assemblies 104 is composed of two metal pads, which are positive pads and negative pads respectively , and the metal pad assembly 104 is formed by patterning one or more metals of titanium Ti, gold Au, tin Sn, copper Cu, indium In, silver Ag, platinum Pt, chromium Cr, nickel Ni . And the surfaces of the positive electrode pad and the negative electrode pad are all connected to the metal pad 105 at the lower end of the micro-light emitting diode chip 103 through the conductive glue 110; wherein, the conductive glue 110 is a photocurable conductive glue, and the main body of the conductive glue 110 includes : Epoxy resin, silicone, and its main...

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Abstract

The invention relates to the technical field of semiconductors, in particular to a micro light-emitting diode display production detection method and a display thereof, and the method comprises the steps: providing a display backboard, and arranging a metal bonding pad assembly on the display backboard; arranging a conductive adhesive on the surface of the metal bonding pad assembly; transferring a micro light-emitting diode chip to a position above the metal bonding pad assembly, and fixing a metal pad at the lower end of the micro light-emitting diode chip temporarily with the surface of the metal bonding pad assembly through the conductive adhesive; carrying out electrical measurement on the micro light-emitting diode chip, and determining whether a bad chip exists or not; if the bad chip exists, taking out the bad chip from the display backboard and replacing the bad chip. According to the micro light-emitting diode display production detection method, the complexity of replacing the micro light-emitting diode chip is greatly reduced, the production efficiency of the display is greatly improved, and a guarantee is brought to rapid mass production of display screens.

Description

technical field [0001] The invention relates to the technical field of light-emitting diodes, in particular to a method for production and detection of a micro-light-emitting diode display and a display made by using the method for production and detection of a micro-light-emitting diode display. Background technique [0002] Micro LED (Micro LED), that is, light-emitting diode miniaturization and matrix technology, has good stability, life, and advantages in operating temperature, and also inherits LED low power consumption, color saturation, and fast response. , strong contrast and other advantages, it has great application prospects. [0003] The display screen made of micro light emitting diodes is the mainstream development direction of display equipment in the future; in the manufacturing process of the existing micro light emitting diode displays, the micro light emitting diode chips need to be generated on the growth substrate first; Transfer to the display backplan...

Claims

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Application Information

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IPC IPC(8): G09G3/00
CPCG09G3/006
Inventor 安金鑫林子平李刘中张雪肖守均
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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