Preparation method of nano film-coating liquid

Abstract

The invention belongs to the technical field of electronic product film-coating, and particularly relates to a preparation method of a nano film-coating liquid, wherein the preparation method comprises the steps: selecting 10-20 parts by mass of cuprous oxide, 10-30 parts by mass of glass fibers, 60-80 parts by mass of polyether polyol, 30-40 parts by mass of isophorone diisocyanate, 60-70 parts by mass of deionized water, 40-45 parts by mass of a polyethylene wax emulsion and 80-100 parts by mass of sol resin; dehydrating polyether polyol to obtain a dehydrated alcohol solution; adding isophorone diisocyanate and cuprous oxide with the mass of 1 / 3-1 / 2 of the total mass into the dehydrated alcohol solution, and mixing to obtain a polyurethane prepolymer; adding deionized water and the polyethylene wax emulsion into the polyurethane prepolymer, and mixing to form an emulsion; and adding the glass fibers and the residual cuprous oxide into sol resin, uniformly mixing and then adding the mixture into the emulsion to form the blue film-coating liquid. Therefore, no peculiar smell exists in the preparation process, and the electronic product sprayed with the film-coating liquid has the blue light prevention effect.

Description

technical field [0001] The invention belongs to the technical field of film coating of electronic products, and in particular relates to a preparation method of a nano-coating liquid. Background technique [0002] With the continuous application of electronic products, although we don't need to carry certain electronic equipment to work or live underwater for a long time, sometimes accidental immersion in life will cause electronic products to die instantly, such as washing, rain, running, etc. sweat etc. Therefore, waterproofing of electronic products has gradually become a standard configuration of electronic products. [0003] Among them, the most commonly used waterproof design is structural waterproofing. Through water repellency and flow diversion, the external package is effectively isolated from the internal electrical part, that is, the mold of the product has the characteristics of sealing, so as to achieve the purpose of waterproofing, and the cost is low; the se...

AI Technical Summary

Problems solved by technology

[0003] Among them, the most commonly used waterproof design is structural waterproofing. Through water repellency and flow diversion, the external package is effectively isolated from the internal electrical part, that is, the mold of the product has the characteristics of sealing, so as to achieve the purpose of waterproofing, and the cost is low; the second is to use Epoxy resin wraps the PCB board of electronic products for potting and waterproofing, which greatly improves the service life of the circuit board, but this method has poor heat dissipation effect and high repair cost; while high-end electronic products are often covered on the PCB board. Nano-coating, the thickness is only 2-4 microns, which effectively reduces the surface energy of the PCB, forms a lotus leaf effect, has good heat dissipation performance, does not affect the normal conduction of the connector, and achieves a good waterproof effect

[0004] However, the formulations of the nano-coatings used today are complex, and often produce a large amount of toxic gases or odors during preparation, resulting in high preparation costs

Images