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Method for manufacturing circuit board solder mask pattern

A production method and circuit board technology, which are applied in the directions of printed circuit manufacturing, printed circuits, and assembling printed circuits with electrical components, can solve problems such as low production efficiency, and achieve the effects of accurate size, cost reduction, and process capability.

Active Publication Date: 2021-10-01
德中(天津)技术发展股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the industry is also trying to use laser alone to directly ablate the solder resist on the pad to produce high-precision solder resist patterns, but due to the low production efficiency, it has not yet been applied on a large scale

Method used

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  • Method for manufacturing circuit board solder mask pattern
  • Method for manufacturing circuit board solder mask pattern
  • Method for manufacturing circuit board solder mask pattern

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] A method for making a circuit board solder resist pattern, comprising the steps of:

[0058] (1) Solder resist coating:

[0059] Apply solder resist 3 to the circuit board to be processed by screen printing, use 43T mesh to evenly coat both sides of the circuit board 1 with photosensitive ink, and let it stand for 20 minutes;

[0060] (2) Solder resist pre-curing:

[0061] Bake the circuit board 1 coated with the solder resist 3 in an oven at 70°C for 25 minutes, the purpose is to evaporate the solvent of the wet solder resist, and the solder resist on the board surface is initially hardened to prepare for exposure;

[0062] (3) Solder resist pattern exposure:

[0063] According to customer information and processing error t of exposure and development 0 Make an exposure tool film, the solder resist pattern 4 on the film is smaller than the corresponding pad 2 on one side by P 0 , P 0 = t 0 = 75μm (the processing error of each factory is slightly different, genera...

Embodiment 2

[0074] A method for making a circuit board solder resist pattern, comprising the steps of:

[0075] (1) Make solder resist pattern:

[0076] According to customer information and processing errors, make a screen with a preset masking pattern, and the size of the masking pattern is smaller than the corresponding pad 2 on one side by P 0 , P 0 = t 0 = 100μm (the processing error of each factory is slightly different, generally 100μm), and the solder resist pattern is directly produced on the circuit board through the process of screen printing;

[0077] (2) The solder mask is completely cured:

[0078] Place the printed circuit board with the solder resist pattern in a 150°C oven and bake for 60 minutes to completely cure the solder resist;

[0079] (3) Use laser to trim the solder resist pattern:

[0080] Place the circuit board after the solder resist is completely cured on the laser equipment, and the laser equipment generates a trimming area P for laser photoetching bas...

Embodiment 3

[0085] A method for making a circuit board solder resist pattern, comprising the steps of:

[0086] (1) Solder resist coating:

[0087] Apply solder resist 3 to the circuit board to be processed by screen printing, use 43T mesh to evenly coat both sides of the circuit board 1 with photosensitive ink, and let it stand for 20 minutes;

[0088] (2) Solder resist pre-curing:

[0089] Bake the circuit board 1 coated with the solder resist 3 in an oven at 70°C for 25 minutes, the purpose is to evaporate the solvent of the wet solder resist, and the solder resist on the board surface is initially hardened to prepare for exposure;

[0090] (3) Solder resist pattern exposure:

[0091] According to the processing error of exposure and development t 0 Analyze the solder resist pattern in the customer's information, and confirm that only the solder resist pattern of the BGA position requires a precision higher than 2t 0 (Machining error t of each factory 0 Slightly different, general...

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PUM

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Abstract

The invention provides a method for manufacturing a circuit board solder mask pattern, which comprises the following steps of firstly manufacturing a solder mask pattern which is slightly smaller than a corresponding bonding pad, and then trimming the solder mask pattern by using a laser etching removal process so as to obtain the solder mask pattern which is approximately equal to or coincided with the bonding pad. Manufacturing and trimming range of the solder resist pattern is jointly determined by the machining error t0 in the manufacturing process and the machining error t4 in the trimming process. According to the method for manufacturing a circuit board solder mask pattern, the manufacturing cost of the solder mask pattern is reduced, the efficiency and the precision are improved, meanwhile, the process capability is considered, and meanwhile the trimmed solder mask pattern is accurate in size, smooth and free of burrs.

Description

technical field [0001] The invention belongs to the field of circuit board production, and in particular relates to a method for manufacturing a circuit board solder resist pattern. Background technique [0002] The printed circuit board is called the motherboard of electronic products, and it is a basic component used to realize the installation and fixing of components and the electrical connection between them. Printed circuit boards are not universal, and each electronic product needs to be customized according to the characteristics of each product, which is an important factor affecting the quality and cost of electronic products. The entire circuit board production revolves around conductive patterns, conductive holes, solder mask patterns and surface treatment of soldering areas, as well as manufacturing processes such as lamination and molding. [0003] The production of solder resist patterns has always been one of the key processes in the circuit board industry. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/02H05K3/34
CPCH05K3/00H05K3/34H05K3/027
Inventor 方伟胡宏宇
Owner 德中(天津)技术发展股份有限公司