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Thermoelectric module and refrigerator comprising same

A thermoelectric module and thermoelectric element technology, which is applied in the direction of household refrigerators, thermoelectric devices, thermoelectric device components, etc., can solve the problem of the temperature of the heating surface being lower than the indoor temperature, the temperature difference between the heat absorbing surface and the heating surface becomes large, and the thermoelectric module Reduced cooling capacity and other issues to achieve the effect of increasing heat transfer, improving solder wetting, and improving soldering stability

Pending Publication Date: 2021-10-08
LG ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] In the case of the thermoelectric module disclosed in the prior art, since the heating surface is cooled by indoor air, there is a limitation that the temperature of the heating surface cannot be made lower than the room temperature.
[0012] In a state where the temperature of the heat-generating surface is practically fixed, it is necessary to increase the supply current to lower the temperature of the heat-absorbing surface, thereby reducing the efficiency of the thermoelectric module.
[0013] In addition, if the supply current is increased, the temperature difference between the heat-absorbing surface and the heat-generating surface becomes large, resulting in a decrease in the cooling capacity of the thermoelectric module

Method used

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  • Thermoelectric module and refrigerator comprising same
  • Thermoelectric module and refrigerator comprising same
  • Thermoelectric module and refrigerator comprising same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0179] Figure 8 is a sectional view of the thermoelectric module according to the first embodiment of the present invention.

[0180] refer to Figure 8 , the thermoelectric module 20 of the first embodiment of the present invention may include: a thermoelectric element 40; a cold-side radiator 22 attached to the heat-absorbing surface of the thermoelectric element 40; a hot side attached to the heating surface of the thermoelectric element 40 a radiator 24; and a sealing cover 26 connecting the edges of the cold-side radiator 22 and the hot-side radiator 24.

[0181] As mentioned above, the hot-side radiator 24 may be an evaporator for letting low-temperature refrigerant flow through, but it needs to be clarified that, like the cold-side radiator 22, it may also be an evaporator with high thermal conductivity. metal components.

[0182] In detail, the thermoelectric element 40 may include: a semiconductor element part, the semiconductor element part including a P-type sem...

no. 2 example

[0198] Figure 9 is a cross-sectional view of a thermoelectric module according to a second embodiment of the present invention.

[0199] refer to Figure 9 , the thermoelectric module 20a of the second embodiment of the present invention has the following structure: two thermoelectric elements 40a, 40b are arranged between the cold side radiator 22 and the hot side radiator 24, and the two thermoelectric elements 40a, 40b are covered by the heat transfer block 27 divisions.

[0200] In addition, like the thermoelectric module 20 of the first embodiment, in the thermoelectric module 20a of the present embodiment, the sealing cover 26 surrounds the edge of the cold side radiator 22 and the edge of the hot side radiator 24, thereby blocking foreign matter from flowing into the The interior of the thermoelectric module 20a.

[0201] In addition, similar to the thermoelectric module 20 of the first embodiment, the ceramic substrate is replaced with a heat sink portion.

[0202...

no. 3 example

[0272] Figure 10 is a cross-sectional view of a thermoelectric module according to a third embodiment of the present invention.

[0273] refer to Figure 10 , in the thermoelectric module 20b of the third embodiment of the present invention, the same as the second embodiment, the idea of ​​disposing the two thermoelectric modules 51, 52 between the cold side radiator 22 and the hot side radiator 24 is the same . However, the configurations of the two thermoelectric modules 51, 52 are slightly different.

[0274] In detail, the thermoelectric module 20b of the third embodiment may include: a cold-side radiator 22; a first thermoelectric element 51, whose heat-absorbing surface is attached to the cold-side radiator 22; a second thermoelectric element 52, whose heat-absorbing surface It is connected with the heating surface of the first thermoelectric element 51 in a heat-conductive manner; the hot side radiator 24 is attached to the heating surface of the second thermoelectr...

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Abstract

A thermoelectric module according to an embodiment of the present invention may comprise: a cold sink; a thermoelectric element having a heat absorption surface coupled to the cold sink; a heat sink coupled to a heating surface of the thermoelectric element to dissipate heat transferred from the cold sink to the outside of the thermoelectric element; and a sealing cover for connecting the edge of the cold sink and the edge of the heat sink to surround the thermoelectric element, wherein the cold sink, the heat sink, and the thermoelectric element may be integrally formed by the sealing cover. In addition, the thermoelectric element may be a cascade-type thermoelectric element in which two thermoelectric elements having the same or different specifications are coupled with each other.

Description

technical field [0001] The present invention relates to a thermoelectric module and a refrigerator including the same. Background technique [0002] In general, a refrigerator is a household appliance that stores food at low temperatures, including a refrigerator for storing food in a refrigerated state within a range of 3°C, and a freezer compartment for storing food in a frozen state within a range of -20°C. room. [0003] However, if food such as meat or seafood is stored in a frozen state in the current freezer, the water in the cells of the meat or seafood flows out of the cells during the process of freezing the food at -20°C, causing the cells to destroyed, and a change in taste occurs during thawing. [0004] However, if the temperature condition of the storage compartment is set to an extremely low temperature state significantly lower than the current freezer compartment temperature, whereby the food quickly passes through the freezing point temperature range whe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02F25D23/12F25D11/02F25D15/00H01L35/30H01L35/32H01L35/04H10N10/13H10N10/17H10N10/81H10N10/855
CPCF25B21/02F25D2317/061F25D11/025F25D11/022F25B2600/2511F25B25/00F25B5/02F25B5/04F25B41/20F25B2600/2507H10N19/101H10N10/17H10N10/13F25D23/12F25D15/00F25B2321/023F25B2321/0251F25B2321/0212H10N10/81
Inventor 尹皙俊林亨根李政勋李镐碝
Owner LG ELECTRONICS INC